Multi-Dimensional Integrated Circuit Structures and Methods of Forming the Same

A structure comprises a first die, a second die, an interposer, a third die, and a fourth die. The first die and the second die each have a first surface and a second surface. First conductive connectors are coupled to the first surfaces of the first and second dies, and second conductive connectors...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SEMMELMEYER MARK, GOEL SANDEEP KUMAR
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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