SEMICONDUCTOR DEVICE PACKAGING HAVING SUBSTRATE WITH PRE-ENCAPSULATION THROUGH VIA FORMATION

A method for forming through vias in a semiconductor device package prior to package encapsulation is provided. One or more signal conduits are formed through photolithography and metal deposition on a printed circuit substrate having interconnect pads. After removing photoresistive material, the se...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DAVES GLENN G, GONG ZHIWEI, CHHABRA NAVJOT, HAYES SCOTT M
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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