Printed Circuits with Staggered Contact Pads and Compact Component Mounting Arrangements
Electronic devices may be provided with printed circuits to which integrated circuits and other electrical components may be mounted. A first printed circuit may have a first surface with an array of contact pads arranged in rows and columns. Each column of contact pads may have a series of contact...
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| creator | NIKKHOO MICHAEL SALEHI AMIR CHEN WYEMAN |
| description | Electronic devices may be provided with printed circuits to which integrated circuits and other electrical components may be mounted. A first printed circuit may have a first surface with an array of contact pads arranged in rows and columns. Each column of contact pads may have a series of contact pads separated by gaps. The contact pads in each column may be staggered with respect to the contact pads in adjacent columns such that each contact pad in a given column is horizontally adjacent to associated gaps in the adjacent columns. A component may be mounted to an opposing surface of the printed circuit such that it overlaps one of the gaps between the staggered contact pads. By mounting the component to portions of the first printed circuit that do not overlap the staggered contact pads, the risk of damaging the electrical component during solder reflow operations may be minimized. |
| format | Patent |
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A first printed circuit may have a first surface with an array of contact pads arranged in rows and columns. Each column of contact pads may have a series of contact pads separated by gaps. The contact pads in each column may be staggered with respect to the contact pads in adjacent columns such that each contact pad in a given column is horizontally adjacent to associated gaps in the adjacent columns. A component may be mounted to an opposing surface of the printed circuit such that it overlaps one of the gaps between the staggered contact pads. 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By mounting the component to portions of the first printed circuit that do not overlap the staggered contact pads, the risk of damaging the electrical component during solder reflow operations may be minimized.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzEEKwjAQheFsXIh6hwHXgkkR16UoboRCFdyVoR1jwE7KZIrXtwEP4OqHj8dbmkctgZV6qIJ0U9AEn6AvaBS9J8keWbFTqLFPgJxhGDPkRiZWuMaJNbCHUgTZ0zBjWpvFE9-JNr-uzPZ8ulWXHY2xpTRfEJO298btbWGdO7pDaYv_Vl9pKTsM</recordid><startdate>20130516</startdate><enddate>20130516</enddate><creator>NIKKHOO MICHAEL</creator><creator>SALEHI AMIR</creator><creator>CHEN WYEMAN</creator><scope>EVB</scope></search><sort><creationdate>20130516</creationdate><title>Printed Circuits with Staggered Contact Pads and Compact Component Mounting Arrangements</title><author>NIKKHOO MICHAEL ; SALEHI AMIR ; CHEN WYEMAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2013122725A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>NIKKHOO MICHAEL</creatorcontrib><creatorcontrib>SALEHI AMIR</creatorcontrib><creatorcontrib>CHEN WYEMAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NIKKHOO MICHAEL</au><au>SALEHI AMIR</au><au>CHEN WYEMAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Printed Circuits with Staggered Contact Pads and Compact Component Mounting Arrangements</title><date>2013-05-16</date><risdate>2013</risdate><abstract>Electronic devices may be provided with printed circuits to which integrated circuits and other electrical components may be mounted. A first printed circuit may have a first surface with an array of contact pads arranged in rows and columns. Each column of contact pads may have a series of contact pads separated by gaps. The contact pads in each column may be staggered with respect to the contact pads in adjacent columns such that each contact pad in a given column is horizontally adjacent to associated gaps in the adjacent columns. A component may be mounted to an opposing surface of the printed circuit such that it overlaps one of the gaps between the staggered contact pads. By mounting the component to portions of the first printed circuit that do not overlap the staggered contact pads, the risk of damaging the electrical component during solder reflow operations may be minimized.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Printed Circuits with Staggered Contact Pads and Compact Component Mounting Arrangements |
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