DIRECTED HEATING FOR COMPONENT REWORK

DIRECTED HEATING FOR COMPONENT REWORK

Reworking a component solder attached to a printed circuit board is described. The reworking is accomplished by directing energy only at the solder/pad arrangement used to attach the component to the printed circuit board. In one embodiment, the directed energy takes the form of an alternating magne...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHEN WEYMAN, SALEHI AMIR, NIKKHOO MICHAEL M
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator CHEN WEYMAN
SALEHI AMIR
NIKKHOO MICHAEL M
description Reworking a component solder attached to a printed circuit board is described. The reworking is accomplished by directing energy only at the solder/pad arrangement used to attach the component to the printed circuit board. In one embodiment, the directed energy takes the form of an alternating magnetic field that inductively couples with the solder/pad arrangement. The alternating magnetic field has a frequency at least 800 kHz. In another embodiment, the directed energy takes the form of a laser beam that is concurrently directed at the solder/pad arrangements for liquefying the solder.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2013119051A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2013119051A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2013119051A13</originalsourceid><addsrcrecordid>eNrjZFB18QxydQ5xdVHwcHUM8fRzV3DzD1Jw9vcN8Pdz9QtRCHIN9w_y5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgaGxoaGlgamho6GxsSpAgApVSQm</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>DIRECTED HEATING FOR COMPONENT REWORK</title><source>esp@cenet</source><creator>CHEN WEYMAN ; SALEHI AMIR ; NIKKHOO MICHAEL M</creator><creatorcontrib>CHEN WEYMAN ; SALEHI AMIR ; NIKKHOO MICHAEL M</creatorcontrib><description>Reworking a component solder attached to a printed circuit board is described. The reworking is accomplished by directing energy only at the solder/pad arrangement used to attach the component to the printed circuit board. In one embodiment, the directed energy takes the form of an alternating magnetic field that inductively couples with the solder/pad arrangement. The alternating magnetic field has a frequency at least 800 kHz. In another embodiment, the directed energy takes the form of a laser beam that is concurrently directed at the solder/pad arrangements for liquefying the solder.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130516&amp;DB=EPODOC&amp;CC=US&amp;NR=2013119051A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130516&amp;DB=EPODOC&amp;CC=US&amp;NR=2013119051A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN WEYMAN</creatorcontrib><creatorcontrib>SALEHI AMIR</creatorcontrib><creatorcontrib>NIKKHOO MICHAEL M</creatorcontrib><title>DIRECTED HEATING FOR COMPONENT REWORK</title><description>Reworking a component solder attached to a printed circuit board is described. The reworking is accomplished by directing energy only at the solder/pad arrangement used to attach the component to the printed circuit board. In one embodiment, the directed energy takes the form of an alternating magnetic field that inductively couples with the solder/pad arrangement. The alternating magnetic field has a frequency at least 800 kHz. In another embodiment, the directed energy takes the form of a laser beam that is concurrently directed at the solder/pad arrangements for liquefying the solder.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB18QxydQ5xdVHwcHUM8fRzV3DzD1Jw9vcN8Pdz9QtRCHIN9w_y5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgaGxoaGlgamho6GxsSpAgApVSQm</recordid><startdate>20130516</startdate><enddate>20130516</enddate><creator>CHEN WEYMAN</creator><creator>SALEHI AMIR</creator><creator>NIKKHOO MICHAEL M</creator><scope>EVB</scope></search><sort><creationdate>20130516</creationdate><title>DIRECTED HEATING FOR COMPONENT REWORK</title><author>CHEN WEYMAN ; SALEHI AMIR ; NIKKHOO MICHAEL M</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2013119051A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEN WEYMAN</creatorcontrib><creatorcontrib>SALEHI AMIR</creatorcontrib><creatorcontrib>NIKKHOO MICHAEL M</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEN WEYMAN</au><au>SALEHI AMIR</au><au>NIKKHOO MICHAEL M</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DIRECTED HEATING FOR COMPONENT REWORK</title><date>2013-05-16</date><risdate>2013</risdate><abstract>Reworking a component solder attached to a printed circuit board is described. The reworking is accomplished by directing energy only at the solder/pad arrangement used to attach the component to the printed circuit board. In one embodiment, the directed energy takes the form of an alternating magnetic field that inductively couples with the solder/pad arrangement. The alternating magnetic field has a frequency at least 800 kHz. In another embodiment, the directed energy takes the form of a laser beam that is concurrently directed at the solder/pad arrangements for liquefying the solder.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2013119051A1
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title DIRECTED HEATING FOR COMPONENT REWORK
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-06T23%3A09%3A24IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHEN%20WEYMAN&rft.date=2013-05-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2013119051A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true