LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING MODULE COMPRISING THE SAME

Exemplary embodiments of the present invention provide a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is arranged, and a package body supporting the lead frame. The lead frame includes a first terminal grou...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIM SANG EUN, KIM BYOUNG SUNG, LEE JAE JIN, SON YEOUN CHUL
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS
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