PACKAGE STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

A package structure and a manufacturing method for the same are provided. The package structure includes a chip, a substrate and at least one adhesive layer. The chip has at least one electrode portion. The substrate has at least one circuit portion. The adhesive layer is disposed between the electr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHIANG CHUNG-I, JAN FONG-YEE, LOU WEING
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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