LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING MODULE COMPRISING THE SAME

LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING MODULE COMPRISING THE SAME

Exemplary embodiments of the present invention provide a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is arranged, and a package body supporting the lead frame. The lead frame includes a first terminal grou...

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Hauptverfasser: LIM SANG EUN, KIM BYOUNG SUNG, LEE JAE JIN, SON YEOUN CHUL
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator LIM SANG EUN
KIM BYOUNG SUNG
LEE JAE JIN
SON YEOUN CHUL
description Exemplary embodiments of the present invention provide a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is arranged, and a package body supporting the lead frame. The lead frame includes a first terminal group arranged at a first side of the chip area and a second terminal group arranged at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal and a second terminal, and in at least one of the first terminal group and the second terminal group, the first terminal is connected to the chip area and the second terminal is separated from the chip area. The first terminal has a first width, the second terminal has a second width, and the first width is different than the second width.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2013105851A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2013105851A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2013105851A13</originalsourceid><addsrcrecordid>eNrjZPDy8XT3CFFw9fUMCfH0c1dw8fR3cVUIcHT2dnR3VXD0c1FAU-Dr7xLq46rg7O8bEOQZDBIJ8XBVCHb0deVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhsaGBqYWpoaOhsbEqQIA6Rkt9w</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING MODULE COMPRISING THE SAME</title><source>esp@cenet</source><creator>LIM SANG EUN ; KIM BYOUNG SUNG ; LEE JAE JIN ; SON YEOUN CHUL</creator><creatorcontrib>LIM SANG EUN ; KIM BYOUNG SUNG ; LEE JAE JIN ; SON YEOUN CHUL</creatorcontrib><description>Exemplary embodiments of the present invention provide a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is arranged, and a package body supporting the lead frame. The lead frame includes a first terminal group arranged at a first side of the chip area and a second terminal group arranged at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal and a second terminal, and in at least one of the first terminal group and the second terminal group, the first terminal is connected to the chip area and the second terminal is separated from the chip area. The first terminal has a first width, the second terminal has a second width, and the first width is different than the second width.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130502&amp;DB=EPODOC&amp;CC=US&amp;NR=2013105851A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130502&amp;DB=EPODOC&amp;CC=US&amp;NR=2013105851A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIM SANG EUN</creatorcontrib><creatorcontrib>KIM BYOUNG SUNG</creatorcontrib><creatorcontrib>LEE JAE JIN</creatorcontrib><creatorcontrib>SON YEOUN CHUL</creatorcontrib><title>LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING MODULE COMPRISING THE SAME</title><description>Exemplary embodiments of the present invention provide a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is arranged, and a package body supporting the lead frame. The lead frame includes a first terminal group arranged at a first side of the chip area and a second terminal group arranged at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal and a second terminal, and in at least one of the first terminal group and the second terminal group, the first terminal is connected to the chip area and the second terminal is separated from the chip area. The first terminal has a first width, the second terminal has a second width, and the first width is different than the second width.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPDy8XT3CFFw9fUMCfH0c1dw8fR3cVUIcHT2dnR3VXD0c1FAU-Dr7xLq46rg7O8bEOQZDBIJ8XBVCHb0deVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhsaGBqYWpoaOhsbEqQIA6Rkt9w</recordid><startdate>20130502</startdate><enddate>20130502</enddate><creator>LIM SANG EUN</creator><creator>KIM BYOUNG SUNG</creator><creator>LEE JAE JIN</creator><creator>SON YEOUN CHUL</creator><scope>EVB</scope></search><sort><creationdate>20130502</creationdate><title>LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING MODULE COMPRISING THE SAME</title><author>LIM SANG EUN ; KIM BYOUNG SUNG ; LEE JAE JIN ; SON YEOUN CHUL</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2013105851A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>LIM SANG EUN</creatorcontrib><creatorcontrib>KIM BYOUNG SUNG</creatorcontrib><creatorcontrib>LEE JAE JIN</creatorcontrib><creatorcontrib>SON YEOUN CHUL</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIM SANG EUN</au><au>KIM BYOUNG SUNG</au><au>LEE JAE JIN</au><au>SON YEOUN CHUL</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING MODULE COMPRISING THE SAME</title><date>2013-05-02</date><risdate>2013</risdate><abstract>Exemplary embodiments of the present invention provide a light emitting diode package including a light emitting diode chip, a lead frame having a chip area on which the light emitting diode chip is arranged, and a package body supporting the lead frame. The lead frame includes a first terminal group arranged at a first side of the chip area and a second terminal group arranged at a second side of the chip area. The first terminal group and the second terminal group each include a first terminal and a second terminal, and in at least one of the first terminal group and the second terminal group, the first terminal is connected to the chip area and the second terminal is separated from the chip area. The first terminal has a first width, the second terminal has a second width, and the first width is different than the second width.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title LIGHT EMITTING DIODE PACKAGE AND LIGHT EMITTING MODULE COMPRISING THE SAME
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-18T13%3A32%3A17IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LIM%20SANG%20EUN&rft.date=2013-05-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2013105851A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true