METHOD OF MANUFACTURING CIRCUIT BOARD

METHOD OF MANUFACTURING CIRCUIT BOARD

A method of manufacturing a circuit board includes the steps of preparing a fiber piece housing paste, fabricating a filtered recovery paste, fabricating a reuse paste, sticking a protective film, forming a hole, and filling the hole with the reuse paste. Furthermore, the method includes the steps o...

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Hauptverfasser: HIMORI TSUYOSHI, KATSUMATA MASAAKI, KONDOU TOSHIKAZU
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator HIMORI TSUYOSHI
KATSUMATA MASAAKI
KONDOU TOSHIKAZU
description A method of manufacturing a circuit board includes the steps of preparing a fiber piece housing paste, fabricating a filtered recovery paste, fabricating a reuse paste, sticking a protective film, forming a hole, and filling the hole with the reuse paste. Furthermore, the method includes the steps of forming a protruded portion constituted of the reuse paste, disposing a metallic foil on both sides of a second prepreg to carry out pressurization, heating the second prepreg to cure the second prepreg and the reuse paste, and processing the metallic foil into a wiring pattern.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title METHOD OF MANUFACTURING CIRCUIT BOARD
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