SILICON BASED MICROCHANNEL COOLING AND ELECTRICAL PACKAGE

A chip package includes: a substrate; a plurality of conductive connections in contact with the silicon carrier; a silicon carrier in a prefabricated shape disposed above the substrate, the silicon carrier including: a plurality of through silicon vias for providing interconnections through the sili...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MAGERLEIN JOHN H, KNICKERBOCKER JOHN ULRICH
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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