REMOVAL OF PARTICLES ON BACK SIDE OF WAFER

The present disclosure provides an apparatus for fabricating a semiconductor device. The apparatus includes a mechanical structure that is operable to secure a position of a semiconductor wafer. The wafer has a front surface and a back surface. The apparatus includes a wafer cleaning device that is...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHUNG HANIH, CHANG HSIN-KUO, LIN HSUN-PENG, WANG YUEHIH, HSIEH CHI-JEN
Format:	Patent
Sprache:	eng
Schlagworte:	BRUSHES BRUSHWARE CLEANING CLEANING IN GENERAL HUMAN NECESSITIES PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL TRANSPORTING
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