Method for producing a two-chip assembly and corresponding two-chip assembly
A method for producing a two-chip assembly includes: providing a wafer having a first thickness, which wafer has a front side and a back side, a first plurality of first chips being provided on the front side of the wafer; attaching a second plurality of second chips on the front side of the wafer,...
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| creator | RAUSCHER LUTZ FRITZ JUERGEN BRUENDEL MATHIAS HAAG FRIEDER SPEICHER ROLF FREY JENS |
| description | A method for producing a two-chip assembly includes: providing a wafer having a first thickness, which wafer has a front side and a back side, a first plurality of first chips being provided on the front side of the wafer; attaching a second plurality of second chips on the front side of the wafer, so that every first chip is joined in each instance to a second chip and forms a corresponding two-chip pair; forming a cohesive mold package on the front side of the wafer, so that the second chips are packaged; thinning the wafer from the back side to a second thickness which is less than the first thickness; forming vias from the back side to the second chips; and separating the two-chip pairs into corresponding two-chip assemblies. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2013082406A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2013082406A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2013082406A13</originalsourceid><addsrcrecordid>eNrjZPDxTS3JyE9RSMsvUigoyk8pTc7MS1dIVCgpz9dNzsgsUEgsLk7NTcqpVEjMS1FIzi8qSi0uyM9LAanCUMPDwJqWmFOcyguluRmU3VxDnD10Uwvy44H6EpNT81JL4kODjQwMjQ0sjEwMzBwNjYlTBQB22DbV</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method for producing a two-chip assembly and corresponding two-chip assembly</title><source>esp@cenet</source><creator>RAUSCHER LUTZ ; FRITZ JUERGEN ; BRUENDEL MATHIAS ; HAAG FRIEDER ; SPEICHER ROLF ; FREY JENS</creator><creatorcontrib>RAUSCHER LUTZ ; FRITZ JUERGEN ; BRUENDEL MATHIAS ; HAAG FRIEDER ; SPEICHER ROLF ; FREY JENS</creatorcontrib><description>A method for producing a two-chip assembly includes: providing a wafer having a first thickness, which wafer has a front side and a back side, a first plurality of first chips being provided on the front side of the wafer; attaching a second plurality of second chips on the front side of the wafer, so that every first chip is joined in each instance to a second chip and forms a corresponding two-chip pair; forming a cohesive mold package on the front side of the wafer, so that the second chips are packaged; thinning the wafer from the back side to a second thickness which is less than the first thickness; forming vias from the back side to the second chips; and separating the two-chip pairs into corresponding two-chip assemblies.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130404&DB=EPODOC&CC=US&NR=2013082406A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130404&DB=EPODOC&CC=US&NR=2013082406A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RAUSCHER LUTZ</creatorcontrib><creatorcontrib>FRITZ JUERGEN</creatorcontrib><creatorcontrib>BRUENDEL MATHIAS</creatorcontrib><creatorcontrib>HAAG FRIEDER</creatorcontrib><creatorcontrib>SPEICHER ROLF</creatorcontrib><creatorcontrib>FREY JENS</creatorcontrib><title>Method for producing a two-chip assembly and corresponding two-chip assembly</title><description>A method for producing a two-chip assembly includes: providing a wafer having a first thickness, which wafer has a front side and a back side, a first plurality of first chips being provided on the front side of the wafer; attaching a second plurality of second chips on the front side of the wafer, so that every first chip is joined in each instance to a second chip and forms a corresponding two-chip pair; forming a cohesive mold package on the front side of the wafer, so that the second chips are packaged; thinning the wafer from the back side to a second thickness which is less than the first thickness; forming vias from the back side to the second chips; and separating the two-chip pairs into corresponding two-chip assemblies.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPDxTS3JyE9RSMsvUigoyk8pTc7MS1dIVCgpz9dNzsgsUEgsLk7NTcqpVEjMS1FIzi8qSi0uyM9LAanCUMPDwJqWmFOcyguluRmU3VxDnD10Uwvy44H6EpNT81JL4kODjQwMjQ0sjEwMzBwNjYlTBQB22DbV</recordid><startdate>20130404</startdate><enddate>20130404</enddate><creator>RAUSCHER LUTZ</creator><creator>FRITZ JUERGEN</creator><creator>BRUENDEL MATHIAS</creator><creator>HAAG FRIEDER</creator><creator>SPEICHER ROLF</creator><creator>FREY JENS</creator><scope>EVB</scope></search><sort><creationdate>20130404</creationdate><title>Method for producing a two-chip assembly and corresponding two-chip assembly</title><author>RAUSCHER LUTZ ; FRITZ JUERGEN ; BRUENDEL MATHIAS ; HAAG FRIEDER ; SPEICHER ROLF ; FREY JENS</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2013082406A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>RAUSCHER LUTZ</creatorcontrib><creatorcontrib>FRITZ JUERGEN</creatorcontrib><creatorcontrib>BRUENDEL MATHIAS</creatorcontrib><creatorcontrib>HAAG FRIEDER</creatorcontrib><creatorcontrib>SPEICHER ROLF</creatorcontrib><creatorcontrib>FREY JENS</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>RAUSCHER LUTZ</au><au>FRITZ JUERGEN</au><au>BRUENDEL MATHIAS</au><au>HAAG FRIEDER</au><au>SPEICHER ROLF</au><au>FREY JENS</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for producing a two-chip assembly and corresponding two-chip assembly</title><date>2013-04-04</date><risdate>2013</risdate><abstract>A method for producing a two-chip assembly includes: providing a wafer having a first thickness, which wafer has a front side and a back side, a first plurality of first chips being provided on the front side of the wafer; attaching a second plurality of second chips on the front side of the wafer, so that every first chip is joined in each instance to a second chip and forms a corresponding two-chip pair; forming a cohesive mold package on the front side of the wafer, so that the second chips are packaged; thinning the wafer from the back side to a second thickness which is less than the first thickness; forming vias from the back side to the second chips; and separating the two-chip pairs into corresponding two-chip assemblies.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Method for producing a two-chip assembly and corresponding two-chip assembly |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T14%3A34%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=RAUSCHER%20LUTZ&rft.date=2013-04-04&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2013082406A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |