PROCESS OF FORMING TRANSPARENT CONDUCTIVE COATINGS WITH SINTERING ADDITIVES
A process is disclosed for the delayed sintering of metal nanoparticles in a self-assembled transparent conductive coating by incorporating a sintering additive into the water phase of the emulsion used to form the coating. The sintering additive reduces the standard reduction potential of the metal...
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| creator | HAYMOV ILANA ZAMIR DOV YAFRAMENKO NIKOLAY |
| description | A process is disclosed for the delayed sintering of metal nanoparticles in a self-assembled transparent conductive coating by incorporating a sintering additive into the water phase of the emulsion used to form the coating. The sintering additive reduces the standard reduction potential of the metal ion of the metal forming the nanoparticles by an amount greater than 0.1 V but less than the full reduction potential of the metal ion. Emulsion compositions used in the process are also disclosed. |
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| subjects | APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INSULATORS PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
| title | PROCESS OF FORMING TRANSPARENT CONDUCTIVE COATINGS WITH SINTERING ADDITIVES |
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