Metallized Films, Pressure-Sensitive Label Structures, and Methods of Making Same

Multilayer polymer films are described. The films include an oriented polymeric substrate wherein a print-side skin layer of the substrate has a surface roughness, Ra, 12.0 μm. The films also include a metal layer in surface contact with the print side of the polymeric substrate, a primer compositio...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LOCKHART MARK W, MCGEE DENNIS E, CAMPEAU ANNE P
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES APPARATUS THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMISTRY DYES ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	LOCKHART MARK W MCGEE DENNIS E CAMPEAU ANNE P
description	Multilayer polymer films are described. The films include an oriented polymeric substrate wherein a print-side skin layer of the substrate has a surface roughness, Ra, 12.0 μm. The films also include a metal layer in surface contact with the print side of the polymeric substrate, a primer composition in surface contact with the metal layer, and a printable topcoat layer in surface contact with the primer composition. Pressure-sensitive label structures and methods of making such films are also described.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2013059119A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2013059119A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2013059119A13</originalsourceid><addsrcrecordid>eNrjZAj0TS1JzMnJrEpNUXDLzMkt1lEIKEotLi4tStUNTs0rzizJLEtV8ElMSs1RCC4pKk0uAcoAFSXmpSgAtWbkpxQr5Kcp-CZmZ-alKwQn5qbyMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL40GAjA0NjA1NLQ0NLR0Nj4lQBAFf7N8U</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Metallized Films, Pressure-Sensitive Label Structures, and Methods of Making Same</title><source>esp@cenet</source><creator>LOCKHART MARK W ; MCGEE DENNIS E ; CAMPEAU ANNE P</creator><creatorcontrib>LOCKHART MARK W ; MCGEE DENNIS E ; CAMPEAU ANNE P</creatorcontrib><description>Multilayer polymer films are described. The films include an oriented polymeric substrate wherein a print-side skin layer of the substrate has a surface roughness, Ra, 12.0 μm. The films also include a metal layer in surface contact with the print side of the polymeric substrate, a primer composition in surface contact with the metal layer, and a printable topcoat layer in surface contact with the primer composition. Pressure-sensitive label structures and methods of making such films are also described.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; APPARATUS THEREFOR ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; CHEMISTRY ; DYES ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130307&DB=EPODOC&CC=US&NR=2013059119A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130307&DB=EPODOC&CC=US&NR=2013059119A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LOCKHART MARK W</creatorcontrib><creatorcontrib>MCGEE DENNIS E</creatorcontrib><creatorcontrib>CAMPEAU ANNE P</creatorcontrib><title>Metallized Films, Pressure-Sensitive Label Structures, and Methods of Making Same</title><description>Multilayer polymer films are described. The films include an oriented polymeric substrate wherein a print-side skin layer of the substrate has a surface roughness, Ra, 12.0 μm. The films also include a metal layer in surface contact with the print side of the polymeric substrate, a primer composition in surface contact with the metal layer, and a printable topcoat layer in surface contact with the primer composition. Pressure-sensitive label structures and methods of making such films are also described.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>APPARATUS THEREFOR</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAj0TS1JzMnJrEpNUXDLzMkt1lEIKEotLi4tStUNTs0rzizJLEtV8ElMSs1RCC4pKk0uAcoAFSXmpSgAtWbkpxQr5Kcp-CZmZ-alKwQn5qbyMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL40GAjA0NjA1NLQ0NLR0Nj4lQBAFf7N8U</recordid><startdate>20130307</startdate><enddate>20130307</enddate><creator>LOCKHART MARK W</creator><creator>MCGEE DENNIS E</creator><creator>CAMPEAU ANNE P</creator><scope>EVB</scope></search><sort><creationdate>20130307</creationdate><title>Metallized Films, Pressure-Sensitive Label Structures, and Methods of Making Same</title><author>LOCKHART MARK W ; MCGEE DENNIS E ; CAMPEAU ANNE P</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2013059119A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>APPARATUS THEREFOR</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>LOCKHART MARK W</creatorcontrib><creatorcontrib>MCGEE DENNIS E</creatorcontrib><creatorcontrib>CAMPEAU ANNE P</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LOCKHART MARK W</au><au>MCGEE DENNIS E</au><au>CAMPEAU ANNE P</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Metallized Films, Pressure-Sensitive Label Structures, and Methods of Making Same</title><date>2013-03-07</date><risdate>2013</risdate><abstract>Multilayer polymer films are described. The films include an oriented polymeric substrate wherein a print-side skin layer of the substrate has a surface roughness, Ra, 12.0 μm. The films also include a metal layer in surface contact with the print side of the polymeric substrate, a primer composition in surface contact with the metal layer, and a printable topcoat layer in surface contact with the primer composition. Pressure-sensitive label structures and methods of making such films are also described.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_epo_espacenet_US2013059119A1
source	esp@cenet
subjects	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES APPARATUS THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMISTRY DYES ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING USE OF MATERIALS AS ADHESIVES
title	Metallized Films, Pressure-Sensitive Label Structures, and Methods of Making Same
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-09T12%3A41%3A20IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LOCKHART%20MARK%20W&rft.date=2013-03-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2013059119A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true