MEMS AIRFLOW SENSOR DIE INCORPORATING ADDITIONAL CIRCUITRY ON THE DIE

A MEMS airflow sensor die having a heater control circuit, differential instrumentation amplifier, temperature compensation, and/or offset correction circuitry integrated with an airflow sensor on the MEMS die. The added circuitry may be placed on space available on the basic airflow die with MEMS f...

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Hauptverfasser: RICKS LAMAR FLOYD, QASIMI MOHAMMED ABDUL JAVVAD
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creator RICKS LAMAR FLOYD
QASIMI MOHAMMED ABDUL JAVVAD
description A MEMS airflow sensor die having a heater control circuit, differential instrumentation amplifier, temperature compensation, and/or offset correction circuitry integrated with an airflow sensor on the MEMS die. The added circuitry may be placed on space available on the basic airflow die with MEMS fabrication techniques without enlarging the sensor die. The die with the added circuitry may result in a device having a reduced form factor, improved reliability and lower cost.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2013055826A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2013055826A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2013055826A13</originalsourceid><addsrcrecordid>eNrjZHD1dfUNVnD0DHLz8Q9XCHb1C_YPUnDxdFXw9HP2DwrwD3IM8fRzV3B0cfEM8fT3c_RRcPYMcg71DAmKVPD3UwjxcAWp5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgaGxgamphZGZo6GxsSpAgA4sSz4</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MEMS AIRFLOW SENSOR DIE INCORPORATING ADDITIONAL CIRCUITRY ON THE DIE</title><source>esp@cenet</source><creator>RICKS LAMAR FLOYD ; QASIMI MOHAMMED ABDUL JAVVAD</creator><creatorcontrib>RICKS LAMAR FLOYD ; QASIMI MOHAMMED ABDUL JAVVAD</creatorcontrib><description>A MEMS airflow sensor die having a heater control circuit, differential instrumentation amplifier, temperature compensation, and/or offset correction circuitry integrated with an airflow sensor on the MEMS die. The added circuitry may be placed on space available on the basic airflow die with MEMS fabrication techniques without enlarging the sensor die. The die with the added circuitry may result in a device having a reduced form factor, improved reliability and lower cost.</description><language>eng</language><subject>MEASURING ; MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL ; METERING BY VOLUME ; PHYSICS ; TESTING</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130307&amp;DB=EPODOC&amp;CC=US&amp;NR=2013055826A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130307&amp;DB=EPODOC&amp;CC=US&amp;NR=2013055826A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RICKS LAMAR FLOYD</creatorcontrib><creatorcontrib>QASIMI MOHAMMED ABDUL JAVVAD</creatorcontrib><title>MEMS AIRFLOW SENSOR DIE INCORPORATING ADDITIONAL CIRCUITRY ON THE DIE</title><description>A MEMS airflow sensor die having a heater control circuit, differential instrumentation amplifier, temperature compensation, and/or offset correction circuitry integrated with an airflow sensor on the MEMS die. The added circuitry may be placed on space available on the basic airflow die with MEMS fabrication techniques without enlarging the sensor die. The die with the added circuitry may result in a device having a reduced form factor, improved reliability and lower cost.</description><subject>MEASURING</subject><subject>MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL</subject><subject>METERING BY VOLUME</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD1dfUNVnD0DHLz8Q9XCHb1C_YPUnDxdFXw9HP2DwrwD3IM8fRzV3B0cfEM8fT3c_RRcPYMcg71DAmKVPD3UwjxcAWp5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgaGxgamphZGZo6GxsSpAgA4sSz4</recordid><startdate>20130307</startdate><enddate>20130307</enddate><creator>RICKS LAMAR FLOYD</creator><creator>QASIMI MOHAMMED ABDUL JAVVAD</creator><scope>EVB</scope></search><sort><creationdate>20130307</creationdate><title>MEMS AIRFLOW SENSOR DIE INCORPORATING ADDITIONAL CIRCUITRY ON THE DIE</title><author>RICKS LAMAR FLOYD ; QASIMI MOHAMMED ABDUL JAVVAD</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2013055826A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>MEASURING</topic><topic>MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL</topic><topic>METERING BY VOLUME</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>RICKS LAMAR FLOYD</creatorcontrib><creatorcontrib>QASIMI MOHAMMED ABDUL JAVVAD</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>RICKS LAMAR FLOYD</au><au>QASIMI MOHAMMED ABDUL JAVVAD</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MEMS AIRFLOW SENSOR DIE INCORPORATING ADDITIONAL CIRCUITRY ON THE DIE</title><date>2013-03-07</date><risdate>2013</risdate><abstract>A MEMS airflow sensor die having a heater control circuit, differential instrumentation amplifier, temperature compensation, and/or offset correction circuitry integrated with an airflow sensor on the MEMS die. The added circuitry may be placed on space available on the basic airflow die with MEMS fabrication techniques without enlarging the sensor die. The die with the added circuitry may result in a device having a reduced form factor, improved reliability and lower cost.</abstract><oa>free_for_read</oa></addata></record>
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subjects MEASURING
MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL
METERING BY VOLUME
PHYSICS
TESTING
title MEMS AIRFLOW SENSOR DIE INCORPORATING ADDITIONAL CIRCUITRY ON THE DIE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-20T16%3A01%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=RICKS%20LAMAR%20FLOYD&rft.date=2013-03-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2013055826A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true