MEMS AIRFLOW SENSOR DIE INCORPORATING ADDITIONAL CIRCUITRY ON THE DIE
A MEMS airflow sensor die having a heater control circuit, differential instrumentation amplifier, temperature compensation, and/or offset correction circuitry integrated with an airflow sensor on the MEMS die. The added circuitry may be placed on space available on the basic airflow die with MEMS f...
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creator | RICKS LAMAR FLOYD QASIMI MOHAMMED ABDUL JAVVAD |
description | A MEMS airflow sensor die having a heater control circuit, differential instrumentation amplifier, temperature compensation, and/or offset correction circuitry integrated with an airflow sensor on the MEMS die. The added circuitry may be placed on space available on the basic airflow die with MEMS fabrication techniques without enlarging the sensor die. The die with the added circuitry may result in a device having a reduced form factor, improved reliability and lower cost. |
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The added circuitry may be placed on space available on the basic airflow die with MEMS fabrication techniques without enlarging the sensor die. The die with the added circuitry may result in a device having a reduced form factor, improved reliability and lower cost.</description><language>eng</language><subject>MEASURING ; MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL ; METERING BY VOLUME ; PHYSICS ; TESTING</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130307&DB=EPODOC&CC=US&NR=2013055826A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130307&DB=EPODOC&CC=US&NR=2013055826A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RICKS LAMAR FLOYD</creatorcontrib><creatorcontrib>QASIMI MOHAMMED ABDUL JAVVAD</creatorcontrib><title>MEMS AIRFLOW SENSOR DIE INCORPORATING ADDITIONAL CIRCUITRY ON THE DIE</title><description>A MEMS airflow sensor die having a heater control circuit, differential instrumentation amplifier, temperature compensation, and/or offset correction circuitry integrated with an airflow sensor on the MEMS die. The added circuitry may be placed on space available on the basic airflow die with MEMS fabrication techniques without enlarging the sensor die. 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The added circuitry may be placed on space available on the basic airflow die with MEMS fabrication techniques without enlarging the sensor die. The die with the added circuitry may result in a device having a reduced form factor, improved reliability and lower cost.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | MEASURING MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL METERING BY VOLUME PHYSICS TESTING |
title | MEMS AIRFLOW SENSOR DIE INCORPORATING ADDITIONAL CIRCUITRY ON THE DIE |
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