COMPOSITION FOR CLEANING SUBSTRATES POST-CHEMICAL MECHANICAL POLISHING

A semiconductor processing composition and method for cleaning semiconductor wafers post chemical mechanical polishing comprising a phosphorous base and optionally at least one surfactant.

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Hauptverfasser: OTAKE ATSUSHI, BERNATIS PAUL R, SHANG CASS X
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Sprache:eng
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creator OTAKE ATSUSHI
BERNATIS PAUL R
SHANG CASS X
description A semiconductor processing composition and method for cleaning semiconductor wafers post chemical mechanical polishing comprising a phosphorous base and optionally at least one surfactant.
format Patent
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subjects ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES
CANDLES
CHEMISTRY
DETERGENT COMPOSITIONS
DETERGENTS
FATTY ACIDS THEREFROM
METALLURGY
RECOVERY OF GLYCEROL
RESIN SOAPS
SOAP OR SOAP-MAKING
USE OF SINGLE SUBSTANCES AS DETERGENTS
title COMPOSITION FOR CLEANING SUBSTRATES POST-CHEMICAL MECHANICAL POLISHING
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