DIE HAVING WIRE BOND ALIGNMENT SENSING STRUCTURES

A semiconductor die includes a substrate having a topside including active circuitry having an array of bond pads thereon separated by gaps including a minimum gap. At least a portion of the array of bond pads are connected to nodes in the active circuitry. At least one wire bond alignment sensing s...

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Bibliographische Detailangaben

1. Verfasser:	KIM CHANGDUK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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