RESIN COMPOSITION FOR ADHESIVE, ADHESIVE CONTAINING RESIN COMPOSITION FOR ADHESIVE, ADHESIVE SHEET CONTAINING RESIN COMPOSITION FOR ADHESIVE, AND PRINTED WIRING BOARD INCLUDING ADHESIVE OR ADHESIVE SHEET AS ADHESIVE LAYER
Provided is a resin composition for an adhesive comprising a polyurethane resin containing a carboxyl group, having specific range of an acid value having specific range of a number average molecular weight and having specific range of a glass transition temperature a polyester resin having specific...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | NANBARA SHINTARO TANAKA HIDEAKI ITO TAKESHI ASADA HIROKO TANIKAWA YUTO KENMOTSU YOICHI |
| description | Provided is a resin composition for an adhesive comprising a polyurethane resin containing a carboxyl group, having specific range of an acid value having specific range of a number average molecular weight and having specific range of a glass transition temperature a polyester resin having specific range of a number average molecular weight and having specific range of a glass transition temperature; an epoxy resin containing a nitrogen atom; and an epoxy resin having a dicyclopentadiene skeleton, in which a content rate of the polyurethane resin to a sum of the polyurethane resin and the polyester resin is 70 to 95 percent by mass, a content rate of the total epoxy resin contained in the resin composition to the sum of the polyurethane resin and the polyester resin is 5 to 30 percent by mass. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2013020118A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2013020118A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2013020118A13</originalsourceid><addsrcrecordid>eNrjZLgb5Brs6afg7O8b4B_sGeLp76fg5h-k4OjiARQPc9WBs4BK_EIcPf08_dwViNYT7OHqGkKSTj8XhYAgT78QVxeFcM8gkBYnf8cgFwVPP2efUBcQH244kkaoRY7BCBEfx0jXIB4G1rTEnOJUXijNzaDs5hri7KGbWpAfn1pckJicmpdaEh8abGRgaGwAJAwtHA2NiVMFAER8VlI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>RESIN COMPOSITION FOR ADHESIVE, ADHESIVE CONTAINING RESIN COMPOSITION FOR ADHESIVE, ADHESIVE SHEET CONTAINING RESIN COMPOSITION FOR ADHESIVE, AND PRINTED WIRING BOARD INCLUDING ADHESIVE OR ADHESIVE SHEET AS ADHESIVE LAYER</title><source>esp@cenet</source><creator>NANBARA SHINTARO ; TANAKA HIDEAKI ; ITO TAKESHI ; ASADA HIROKO ; TANIKAWA YUTO ; KENMOTSU YOICHI</creator><creatorcontrib>NANBARA SHINTARO ; TANAKA HIDEAKI ; ITO TAKESHI ; ASADA HIROKO ; TANIKAWA YUTO ; KENMOTSU YOICHI</creatorcontrib><description>Provided is a resin composition for an adhesive comprising a polyurethane resin containing a carboxyl group, having specific range of an acid value having specific range of a number average molecular weight and having specific range of a glass transition temperature a polyester resin having specific range of a number average molecular weight and having specific range of a glass transition temperature; an epoxy resin containing a nitrogen atom; and an epoxy resin having a dicyclopentadiene skeleton, in which a content rate of the polyurethane resin to a sum of the polyurethane resin and the polyester resin is 70 to 95 percent by mass, a content rate of the total epoxy resin contained in the resin composition to the sum of the polyurethane resin and the polyester resin is 5 to 30 percent by mass.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130124&DB=EPODOC&CC=US&NR=2013020118A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130124&DB=EPODOC&CC=US&NR=2013020118A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NANBARA SHINTARO</creatorcontrib><creatorcontrib>TANAKA HIDEAKI</creatorcontrib><creatorcontrib>ITO TAKESHI</creatorcontrib><creatorcontrib>ASADA HIROKO</creatorcontrib><creatorcontrib>TANIKAWA YUTO</creatorcontrib><creatorcontrib>KENMOTSU YOICHI</creatorcontrib><title>RESIN COMPOSITION FOR ADHESIVE, ADHESIVE CONTAINING RESIN COMPOSITION FOR ADHESIVE, ADHESIVE SHEET CONTAINING RESIN COMPOSITION FOR ADHESIVE, AND PRINTED WIRING BOARD INCLUDING ADHESIVE OR ADHESIVE SHEET AS ADHESIVE LAYER</title><description>Provided is a resin composition for an adhesive comprising a polyurethane resin containing a carboxyl group, having specific range of an acid value having specific range of a number average molecular weight and having specific range of a glass transition temperature a polyester resin having specific range of a number average molecular weight and having specific range of a glass transition temperature; an epoxy resin containing a nitrogen atom; and an epoxy resin having a dicyclopentadiene skeleton, in which a content rate of the polyurethane resin to a sum of the polyurethane resin and the polyester resin is 70 to 95 percent by mass, a content rate of the total epoxy resin contained in the resin composition to the sum of the polyurethane resin and the polyester resin is 5 to 30 percent by mass.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLgb5Brs6afg7O8b4B_sGeLp76fg5h-k4OjiARQPc9WBs4BK_EIcPf08_dwViNYT7OHqGkKSTj8XhYAgT78QVxeFcM8gkBYnf8cgFwVPP2efUBcQH244kkaoRY7BCBEfx0jXIB4G1rTEnOJUXijNzaDs5hri7KGbWpAfn1pckJicmpdaEh8abGRgaGwAJAwtHA2NiVMFAER8VlI</recordid><startdate>20130124</startdate><enddate>20130124</enddate><creator>NANBARA SHINTARO</creator><creator>TANAKA HIDEAKI</creator><creator>ITO TAKESHI</creator><creator>ASADA HIROKO</creator><creator>TANIKAWA YUTO</creator><creator>KENMOTSU YOICHI</creator><scope>EVB</scope></search><sort><creationdate>20130124</creationdate><title>RESIN COMPOSITION FOR ADHESIVE, ADHESIVE CONTAINING RESIN COMPOSITION FOR ADHESIVE, ADHESIVE SHEET CONTAINING RESIN COMPOSITION FOR ADHESIVE, AND PRINTED WIRING BOARD INCLUDING ADHESIVE OR ADHESIVE SHEET AS ADHESIVE LAYER</title><author>NANBARA SHINTARO ; TANAKA HIDEAKI ; ITO TAKESHI ; ASADA HIROKO ; TANIKAWA YUTO ; KENMOTSU YOICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2013020118A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>NANBARA SHINTARO</creatorcontrib><creatorcontrib>TANAKA HIDEAKI</creatorcontrib><creatorcontrib>ITO TAKESHI</creatorcontrib><creatorcontrib>ASADA HIROKO</creatorcontrib><creatorcontrib>TANIKAWA YUTO</creatorcontrib><creatorcontrib>KENMOTSU YOICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NANBARA SHINTARO</au><au>TANAKA HIDEAKI</au><au>ITO TAKESHI</au><au>ASADA HIROKO</au><au>TANIKAWA YUTO</au><au>KENMOTSU YOICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RESIN COMPOSITION FOR ADHESIVE, ADHESIVE CONTAINING RESIN COMPOSITION FOR ADHESIVE, ADHESIVE SHEET CONTAINING RESIN COMPOSITION FOR ADHESIVE, AND PRINTED WIRING BOARD INCLUDING ADHESIVE OR ADHESIVE SHEET AS ADHESIVE LAYER</title><date>2013-01-24</date><risdate>2013</risdate><abstract>Provided is a resin composition for an adhesive comprising a polyurethane resin containing a carboxyl group, having specific range of an acid value having specific range of a number average molecular weight and having specific range of a glass transition temperature a polyester resin having specific range of a number average molecular weight and having specific range of a glass transition temperature; an epoxy resin containing a nitrogen atom; and an epoxy resin having a dicyclopentadiene skeleton, in which a content rate of the polyurethane resin to a sum of the polyurethane resin and the polyester resin is 70 to 95 percent by mass, a content rate of the total epoxy resin contained in the resin composition to the sum of the polyurethane resin and the polyester resin is 5 to 30 percent by mass.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_US2013020118A1 |
| source | esp@cenet |
| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES |
| title | RESIN COMPOSITION FOR ADHESIVE, ADHESIVE CONTAINING RESIN COMPOSITION FOR ADHESIVE, ADHESIVE SHEET CONTAINING RESIN COMPOSITION FOR ADHESIVE, AND PRINTED WIRING BOARD INCLUDING ADHESIVE OR ADHESIVE SHEET AS ADHESIVE LAYER |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-27T04%3A05%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NANBARA%20SHINTARO&rft.date=2013-01-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2013020118A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |