DUAL PLASMA SOURCE SYSTEMS AND METHODS FOR REACTIVE PLASMA DEPOSITION

A plasma processing system for providing a uniform erosion of a surface of a target is provided. The system includes a dual plasma source arrangement, wherein each plasma source of the dual plasma source arrangement having a source housing for generating plasma therein. The system further includes a...

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Bibliographische Detailangaben
1. Verfasser:	HEGDE HARIHARAKESHAVA SARPANGALA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A plasma processing system for providing a uniform erosion of a surface of a target is provided. The system includes a dual plasma source arrangement, wherein each plasma source of the dual plasma source arrangement having a source housing for generating plasma therein. The system further includes a set of antennas, wherein at least one antenna is positioned outside of the source housing of each plasma source, at least one antenna is configured to be excited with RF power to generate the plasma inside the source housing of the each plasma source. The system yet also includes a magnet assembly configured for directing ions of the plasma within the source housing of the each plasma source through an opening of the source housing toward the surface of the target, wherein the target is positioned between a first plasma source of the dual plasma source arrangement and a second plasma source of the dual plasma source arrangement.