MICROELECTRONIC SUBSTRATE FOR ALTERNATE PACKAGE FUNCTIONALITY

MICROELECTRONIC SUBSTRATE FOR ALTERNATE PACKAGE FUNCTIONALITY

The present disclosure relates to microelectronic substrates, such as interposers, motherboards, test platforms, and the like, that are fabricated to have overlapping connection zones, such that different microelectronic devices, such as microprocessors, chipsets, graphics processing devices, wirele...

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Hauptverfasser: LEE CLIFF C, HOSSAIN MD ALTAF, PINES ITAI M, KELLY BRIAN P, BROWNING DAVID W
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator LEE CLIFF C
HOSSAIN MD ALTAF
PINES ITAI M
KELLY BRIAN P
BROWNING DAVID W
description The present disclosure relates to microelectronic substrates, such as interposers, motherboards, test platforms, and the like, that are fabricated to have overlapping connection zones, such that different microelectronic devices, such as microprocessors, chipsets, graphics processing devices, wireless devices, memory devices, application specific integrated circuits, and the like, may be alternately attached to the microelectronic substrates to form functional microelectronic packages.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title MICROELECTRONIC SUBSTRATE FOR ALTERNATE PACKAGE FUNCTIONALITY
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