METHOD FOR APPLYING SOFT SOLDER TO A MOUNTING SURFACE OF A COMPONENT
The invention relates to a method for applying soft solder to a mounting surface of a component, wherein a connecting means comprising a carrier layer and a soft solder layer formed by physical vapor deposition on the carrier layer is brought into mechanical contact between the soft solder layer and...
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| creator | SCHROEDER MATTHIAS SCHROEDER DOMINIC |
| description | The invention relates to a method for applying soft solder to a mounting surface of a component, wherein a connecting means comprising a carrier layer and a soft solder layer formed by physical vapor deposition on the carrier layer is brought into mechanical contact between the soft solder layer and the mounting surface, such that a first bond strength between the soft solder layer and the mounting surface is greater than a second bond strength between the soft solder layer and the carrier layer. The connecting means is subsequently removed from the component so that the carrier layer releases from the soft solder layer in the area of the mounting surface and thus soft solder remains only at the mounting surface. |
| format | Patent |
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The connecting means is subsequently removed from the component so that the carrier layer releases from the soft solder layer in the area of the mounting surface and thus soft solder remains only at the mounting surface.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20121129&DB=EPODOC&CC=US&NR=2012297616A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20121129&DB=EPODOC&CC=US&NR=2012297616A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SCHROEDER MATTHIAS</creatorcontrib><creatorcontrib>SCHROEDER DOMINIC</creatorcontrib><title>METHOD FOR APPLYING SOFT SOLDER TO A MOUNTING SURFACE OF A COMPONENT</title><description>The invention relates to a method for applying soft solder to a mounting surface of a component, wherein a connecting means comprising a carrier layer and a soft solder layer formed by physical vapor deposition on the carrier layer is brought into mechanical contact between the soft solder layer and the mounting surface, such that a first bond strength between the soft solder layer and the mounting surface is greater than a second bond strength between the soft solder layer and the carrier layer. 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The connecting means is subsequently removed from the component so that the carrier layer releases from the soft solder layer in the area of the mounting surface and thus soft solder remains only at the mounting surface.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | METHOD FOR APPLYING SOFT SOLDER TO A MOUNTING SURFACE OF A COMPONENT |
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