LIQUID COOLING ELEMENT
A cooling element for cooling a plurality of power semiconductor modules including power semiconductor units including a plate made of thermally conductive material. The plate includes channels for carrying a flow of a cooling liquid. The channels include a main supply channel converging in a direct...
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| creator | SEVAEKIVI PERTTI HYYTIAEINEN JAANI |
| description | A cooling element for cooling a plurality of power semiconductor modules including power semiconductor units including a plate made of thermally conductive material. The plate includes channels for carrying a flow of a cooling liquid. The channels include a main supply channel converging in a direction of the flow of the liquid, a main discharge channel diverging in the direction of the flow of the liquid, a plurality of supply channel branches branching from the main input channel, a plurality of discharge channel branches merging to the main discharge channel, and a plurality of power semiconductor unit cooling channels connecting the supply channel branches and the discharge channel branches. Each power semiconductor unit cooling channel is arranged to cool one power semiconductor unit. The plate includes openings for thermally separating the power semiconductor modules from each other. |
| format | Patent |
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The plate includes channels for carrying a flow of a cooling liquid. The channels include a main supply channel converging in a direction of the flow of the liquid, a main discharge channel diverging in the direction of the flow of the liquid, a plurality of supply channel branches branching from the main input channel, a plurality of discharge channel branches merging to the main discharge channel, and a plurality of power semiconductor unit cooling channels connecting the supply channel branches and the discharge channel branches. Each power semiconductor unit cooling channel is arranged to cool one power semiconductor unit. The plate includes openings for thermally separating the power semiconductor modules from each other.</description><language>eng</language><subject>BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT ; HEATING ; LIGHTING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MECHANICAL ENGINEERING ; PRINTED CIRCUITS ; WEAPONS</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20121115&DB=EPODOC&CC=US&NR=2012287577A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20121115&DB=EPODOC&CC=US&NR=2012287577A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SEVAEKIVI PERTTI</creatorcontrib><creatorcontrib>HYYTIAEINEN JAANI</creatorcontrib><title>LIQUID COOLING ELEMENT</title><description>A cooling element for cooling a plurality of power semiconductor modules including power semiconductor units including a plate made of thermally conductive material. The plate includes channels for carrying a flow of a cooling liquid. The channels include a main supply channel converging in a direction of the flow of the liquid, a main discharge channel diverging in the direction of the flow of the liquid, a plurality of supply channel branches branching from the main input channel, a plurality of discharge channel branches merging to the main discharge channel, and a plurality of power semiconductor unit cooling channels connecting the supply channel branches and the discharge channel branches. Each power semiconductor unit cooling channel is arranged to cool one power semiconductor unit. The plate includes openings for thermally separating the power semiconductor modules from each other.</description><subject>BLASTING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MECHANICAL ENGINEERING</subject><subject>PRINTED CIRCUITS</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBDz8QwM9XRRcPb39_H0c1dw9XH1dfUL4WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgaGRkYW5qbm5o6GxsSpAgAw5iAg</recordid><startdate>20121115</startdate><enddate>20121115</enddate><creator>SEVAEKIVI PERTTI</creator><creator>HYYTIAEINEN JAANI</creator><scope>EVB</scope></search><sort><creationdate>20121115</creationdate><title>LIQUID COOLING ELEMENT</title><author>SEVAEKIVI PERTTI ; HYYTIAEINEN JAANI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2012287577A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2012</creationdate><topic>BLASTING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MECHANICAL ENGINEERING</topic><topic>PRINTED CIRCUITS</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>SEVAEKIVI PERTTI</creatorcontrib><creatorcontrib>HYYTIAEINEN JAANI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SEVAEKIVI PERTTI</au><au>HYYTIAEINEN JAANI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LIQUID COOLING ELEMENT</title><date>2012-11-15</date><risdate>2012</risdate><abstract>A cooling element for cooling a plurality of power semiconductor modules including power semiconductor units including a plate made of thermally conductive material. The plate includes channels for carrying a flow of a cooling liquid. The channels include a main supply channel converging in a direction of the flow of the liquid, a main discharge channel diverging in the direction of the flow of the liquid, a plurality of supply channel branches branching from the main input channel, a plurality of discharge channel branches merging to the main discharge channel, and a plurality of power semiconductor unit cooling channels connecting the supply channel branches and the discharge channel branches. Each power semiconductor unit cooling channel is arranged to cool one power semiconductor unit. The plate includes openings for thermally separating the power semiconductor modules from each other.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS WEAPONS |
| title | LIQUID COOLING ELEMENT |
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