MOLD ARRAY PROCESS METHOD TO PREVENT EXPOSURE OF SUBSTRATE PERIPHERIES

Disclosed is a mold array process (MAP) method to prevent exposure of peripheries of substrate units where the major characteristic is to implement two kinds of encapsulating materials in the MAP method in mass production. A first encapsulating material for encapsulating chips is formed on a substra...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHIU WENUN, LEE KUO-YUAN, CHEN YUNG-HSIANG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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