SOLDER BALL CONTACT SUSCEPTIBLE TO LOWER STRESS

A solder ball contact and a method of making a solder ball contact includes: a first insulating layer with a via formed on an integrated circuit (IC) chip and a metal pad; an under bump metallurgy (UBM) structure disposed within the via and on a portion of the first insulating layer, surrounding the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GUERIN LUC, SHAPIRO MICHAEL J, TRUONG VAN T, TRAN-QUINN THUY, INTERRANTE MARIO J
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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