SACRIFICIAL SUBSTRATE FILM FOR BALL LAND PROTECTION

SACRIFICIAL SUBSTRATE FILM FOR BALL LAND PROTECTION

A method of forming solder balls on package substrates includes attaching a semiconductor die to a frontside of a package substrate that includes a film over a bottomside of the package substrate including over a plurality of ball land areas configured to receive solder balls thereon, followed by fo...

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Hauptverfasser: CALPOTURA MARLON CARINO, KIM LESLIE BAHINGAWAN, SANTOS NORBERT JOSON, BALIDOY EDGAR DOROTAYO, DELA CRUZ ARVIN ABELLERA
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator CALPOTURA MARLON CARINO
KIM LESLIE BAHINGAWAN
SANTOS NORBERT JOSON
BALIDOY EDGAR DOROTAYO
DELA CRUZ ARVIN ABELLERA
description A method of forming solder balls on package substrates includes attaching a semiconductor die to a frontside of a package substrate that includes a film over a bottomside of the package substrate including over a plurality of ball land areas configured to receive solder balls thereon, followed by forming an encapsulating mold layer over the semiconductor die. The film blocks contamination such as mold debris from reaching the ball land areas during die attachment and molding. The film is then removed from the bottomside of the package substrate after molding to expose the plurality of exposed ball land areas. Solder balls are dispensed onto the plurality of exposed ball land areas.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SACRIFICIAL SUBSTRATE FILM FOR BALL LAND PROTECTION
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