THERMAL RELATIONSHIPS BASED WORKLOAD PLANNING

THERMAL RELATIONSHIPS BASED WORKLOAD PLANNING

A method for thermal relationships based workload planning in a data processing environment is provided in the illustrative embodiments. For a data processing system having a cooling correspondence with a cooling unit in the data processing environment, a determination is made of a fraction of an ad...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: NASTACIO DENILSON
Format: Patent
Sprache:eng
Schlagworte:
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator NASTACIO DENILSON
description A method for thermal relationships based workload planning in a data processing environment is provided in the illustrative embodiments. For a data processing system having a cooling correspondence with a cooling unit in the data processing environment, a determination is made of a fraction of an additional heat generation potential of the data processing system that the cooling unit will have to dissipate. Using the fraction and a cooling capacity utilization of the cooling unit at a given time, an expected cooling capacity utilization is computed. A workload on the data processing system is adjusted in response to the expected cooling capacity utilization exceeding a threshold.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2012216065A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2012216065A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2012216065A13</originalsourceid><addsrcrecordid>eNrjZNAN8XAN8nX0UQhy9XEM8fT3C_bwDAhWcHIMdnVRCPcP8vbxd3RRCPBx9PPz9HPnYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBoZGRoZmBmamjobGxKkCAGg1JoU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>THERMAL RELATIONSHIPS BASED WORKLOAD PLANNING</title><source>esp@cenet</source><creator>NASTACIO DENILSON</creator><creatorcontrib>NASTACIO DENILSON</creatorcontrib><description>A method for thermal relationships based workload planning in a data processing environment is provided in the illustrative embodiments. For a data processing system having a cooling correspondence with a cooling unit in the data processing environment, a determination is made of a fraction of an additional heat generation potential of the data processing system that the cooling unit will have to dissipate. Using the fraction and a cooling capacity utilization of the cooling unit at a given time, an expected cooling capacity utilization is computed. A workload on the data processing system is adjusted in response to the expected cooling capacity utilization exceeding a threshold.</description><language>eng</language><subject>CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20120823&amp;DB=EPODOC&amp;CC=US&amp;NR=2012216065A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20120823&amp;DB=EPODOC&amp;CC=US&amp;NR=2012216065A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NASTACIO DENILSON</creatorcontrib><title>THERMAL RELATIONSHIPS BASED WORKLOAD PLANNING</title><description>A method for thermal relationships based workload planning in a data processing environment is provided in the illustrative embodiments. For a data processing system having a cooling correspondence with a cooling unit in the data processing environment, a determination is made of a fraction of an additional heat generation potential of the data processing system that the cooling unit will have to dissipate. Using the fraction and a cooling capacity utilization of the cooling unit at a given time, an expected cooling capacity utilization is computed. A workload on the data processing system is adjusted in response to the expected cooling capacity utilization exceeding a threshold.</description><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAN8XAN8nX0UQhy9XEM8fT3C_bwDAhWcHIMdnVRCPcP8vbxd3RRCPBx9PPz9HPnYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBoZGRoZmBmamjobGxKkCAGg1JoU</recordid><startdate>20120823</startdate><enddate>20120823</enddate><creator>NASTACIO DENILSON</creator><scope>EVB</scope></search><sort><creationdate>20120823</creationdate><title>THERMAL RELATIONSHIPS BASED WORKLOAD PLANNING</title><author>NASTACIO DENILSON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2012216065A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2012</creationdate><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>NASTACIO DENILSON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NASTACIO DENILSON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THERMAL RELATIONSHIPS BASED WORKLOAD PLANNING</title><date>2012-08-23</date><risdate>2012</risdate><abstract>A method for thermal relationships based workload planning in a data processing environment is provided in the illustrative embodiments. For a data processing system having a cooling correspondence with a cooling unit in the data processing environment, a determination is made of a fraction of an additional heat generation potential of the data processing system that the cooling unit will have to dissipate. Using the fraction and a cooling capacity utilization of the cooling unit at a given time, an expected cooling capacity utilization is computed. A workload on the data processing system is adjusted in response to the expected cooling capacity utilization exceeding a threshold.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2012216065A1
source esp@cenet
subjects CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
title THERMAL RELATIONSHIPS BASED WORKLOAD PLANNING
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-01T11%3A31%3A32IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NASTACIO%20DENILSON&rft.date=2012-08-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2012216065A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true