Integrated Circuit with Sensor and Method of Manufacturing Such an Integrated Circuit

Disclosed is an integrated circuit comprising a substrate (10) carrying a plurality of circuit elements; a metallization stack (12, 14, 16) interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising a first metal portion (20); a passiv...

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Hauptverfasser: PONOMAREV YOURI VICTOROVITCH, WOLTERS ROBERTUS ADRIANUS MARIA, RONGEN RENE THEODORA HUBERTUS, DAAMEN ROEL
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Disclosed is an integrated circuit comprising a substrate (10) carrying a plurality of circuit elements; a metallization stack (12, 14, 16) interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising a first metal portion (20); a passivation stack (24, 26, 28) covering the metallization stack; and a sensor including a sensing material (40) on the passivation stack, said sensor being coupled to the first metal portion by a via (34) extending through the passivation stack. A method of manufacturing such an IC is also disclosed.