SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND DISPLAY

It is desired to enhance reliability of thermal coupling between a semiconductor chip and a radiating member. A driver assembly has a sheetlike wiring sheet on which lead wires are provided, a driver chip that is mounted over the wiring sheet and is electrically coupled to the lead wire, and a radia...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KUME TORU, YOSHINO ISAO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!