SOLDER MOLD PLATES USED IN PACKAGING PROCESS AND METHOD OF MANUFACTURING SOLDER MOLD PLATES
Solder mold plates and methods of manufacturing the solder mold plates are provided herein. The solder mold plates are used in controlled collapse chip connection processes. The solder mold plate includes a plurality of cavities. At least one cavity of the plurality of cavities has a different volum...
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| creator | GOLDMANN LEWIS S |
| description | Solder mold plates and methods of manufacturing the solder mold plates are provided herein. The solder mold plates are used in controlled collapse chip connection processes. The solder mold plate includes a plurality of cavities. At least one cavity of the plurality of cavities has a different volume than another of the cavities in a particular chip set site. The method of manufacturing the solder mold plate includes determining susceptible white bump locations on a chip set. The method further includes forming lower volume cavities on the solder mold plate which coincide with the susceptible white bump locations, and forming higher volume cavities on the solder mold plate which coincide with less susceptible white bump locations. |
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The solder mold plates are used in controlled collapse chip connection processes. The solder mold plate includes a plurality of cavities. At least one cavity of the plurality of cavities has a different volume than another of the cavities in a particular chip set site. The method of manufacturing the solder mold plate includes determining susceptible white bump locations on a chip set. The method further includes forming lower volume cavities on the solder mold plate which coincide with the susceptible white bump locations, and forming higher volume cavities on the solder mold plate which coincide with less susceptible white bump locations.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASTING ; CASTING OF METALS ; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FOUNDRY MOULDING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; POWDER METALLURGY ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120524&DB=EPODOC&CC=US&NR=2012125556A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120524&DB=EPODOC&CC=US&NR=2012125556A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GOLDMANN LEWIS S</creatorcontrib><title>SOLDER MOLD PLATES USED IN PACKAGING PROCESS AND METHOD OF MANUFACTURING SOLDER MOLD PLATES</title><description>Solder mold plates and methods of manufacturing the solder mold plates are provided herein. The solder mold plates are used in controlled collapse chip connection processes. The solder mold plate includes a plurality of cavities. At least one cavity of the plurality of cavities has a different volume than another of the cavities in a particular chip set site. The method of manufacturing the solder mold plate includes determining susceptible white bump locations on a chip set. The method further includes forming lower volume cavities on the solder mold plate which coincide with the susceptible white bump locations, and forming higher volume cavities on the solder mold plate which coincide with less susceptible white bump locations.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASTING</subject><subject>CASTING OF METALS</subject><subject>CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FOUNDRY MOULDING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>POWDER METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIgO9vdxcQ1S8AVSCgE-jiGuwQqhwa4uCp5-CgGOzt6O7p5-7goBQf7OrsHBCo5-Lgq-riEe_i4K_m4Kvo5-oW6OziGhQSA1mAbxMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL40GAjA0MjQyNTU1MzR0Nj4lQBACNMMrU</recordid><startdate>20120524</startdate><enddate>20120524</enddate><creator>GOLDMANN LEWIS S</creator><scope>EVB</scope></search><sort><creationdate>20120524</creationdate><title>SOLDER MOLD PLATES USED IN PACKAGING PROCESS AND METHOD OF MANUFACTURING SOLDER MOLD PLATES</title><author>GOLDMANN LEWIS S</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2012125556A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2012</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASTING</topic><topic>CASTING OF METALS</topic><topic>CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FOUNDRY MOULDING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>POWDER METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>GOLDMANN LEWIS S</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GOLDMANN LEWIS S</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SOLDER MOLD PLATES USED IN PACKAGING PROCESS AND METHOD OF MANUFACTURING SOLDER MOLD PLATES</title><date>2012-05-24</date><risdate>2012</risdate><abstract>Solder mold plates and methods of manufacturing the solder mold plates are provided herein. The solder mold plates are used in controlled collapse chip connection processes. The solder mold plate includes a plurality of cavities. At least one cavity of the plurality of cavities has a different volume than another of the cavities in a particular chip set site. The method of manufacturing the solder mold plate includes determining susceptible white bump locations on a chip set. The method further includes forming lower volume cavities on the solder mold plate which coincide with the susceptible white bump locations, and forming higher volume cavities on the solder mold plate which coincide with less susceptible white bump locations.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CASTING CASTING OF METALS CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FOUNDRY MOULDING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS POWDER METALLURGY SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | SOLDER MOLD PLATES USED IN PACKAGING PROCESS AND METHOD OF MANUFACTURING SOLDER MOLD PLATES |
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