FIELD SERVICEABLE CPU MODULE

A computer apparatus comprising a computer chassis, a baseboard component disposed within the computer chassis and a computer module electronically coupled to the baseboard component is disclosed. A heat sink assembly is attached to the computer module to form a computer module heat sink assembly, w...

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1. Verfasser:	LANDON TREVOR
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
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creator	LANDON TREVOR
description	A computer apparatus comprising a computer chassis, a baseboard component disposed within the computer chassis and a computer module electronically coupled to the baseboard component is disclosed. A heat sink assembly is attached to the computer module to form a computer module heat sink assembly, wherein the heat sink assembly forms part of an integral exterior structure of the computer chassis. The chassis may comprise a compartment disposed through an exterior surface of the chassis for receiving the computer module heat sink assembly in mated fashion. The computer module heat sink assembly forms a water and air tight seal with the internal compartment of the chassis in mated fashion.
format	Patent
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A heat sink assembly is attached to the computer module to form a computer module heat sink assembly, wherein the heat sink assembly forms part of an integral exterior structure of the computer chassis. The chassis may comprise a compartment disposed through an exterior surface of the chassis for receiving the computer module heat sink assembly in mated fashion. 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A heat sink assembly is attached to the computer module to form a computer module heat sink assembly, wherein the heat sink assembly forms part of an integral exterior structure of the computer chassis. The chassis may comprise a compartment disposed through an exterior surface of the chassis for receiving the computer module heat sink assembly in mated fashion. 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A heat sink assembly is attached to the computer module to form a computer module heat sink assembly, wherein the heat sink assembly forms part of an integral exterior structure of the computer chassis. The chassis may comprise a compartment disposed through an exterior surface of the chassis for receiving the computer module heat sink assembly in mated fashion. The computer module heat sink assembly forms a water and air tight seal with the internal compartment of the chassis in mated fashion.</abstract><oa>free_for_read</oa></addata></record>
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language	eng
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subjects	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
title	FIELD SERVICEABLE CPU MODULE
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