Imaging device package, method of manufacturing the imaging device package, and electronic apparatus

An imaging device package includes: an imaging device chip; a substrate on which the imaging device chip is mounted; a wire that electrically connects the imaging device chip and the substrate at a peripheral edge of the substrate around the imaging device chip; a supporting body that supports an op...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ITOH TOHRU, TSUKUDA YUKIHIKO, SEO RYOTARO, YAMADA TOMOYASU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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