MULTI-CHIP MODULE SYSTEM WITH REMOVABLE SOCKETED MODULES

MULTI-CHIP MODULE SYSTEM WITH REMOVABLE SOCKETED MODULES

A multi-chip module (MCM) includes chip sub-modules that are fabricated as self-contained testable entities. The chip sub-modules plug into respective sockets in a frame of the MCM. Each chip sub-module may be tested before being plugged into the MCM. A chip sub-module may include an IC chip, such a...

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Hauptverfasser: REYNOLDS CHARLES L, HARVEY PAUL MARLAN, COLBERT JOHN LEE, CASEY JON ALFRED, HOFFMEYER MARK KENNETH
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator REYNOLDS CHARLES L
HARVEY PAUL MARLAN
COLBERT JOHN LEE
CASEY JON ALFRED
HOFFMEYER MARK KENNETH
description A multi-chip module (MCM) includes chip sub-modules that are fabricated as self-contained testable entities. The chip sub-modules plug into respective sockets in a frame of the MCM. Each chip sub-module may be tested before being plugged into the MCM. A chip sub-module may include an IC chip, such as a processor, mounted to an sub-module organic substrate that provides interconnects to the chip. The frame into which each chip sub-module plugs sits on a mini-card organic substrate that interconnects the chip sub-modules together. The MCM may include a downstop between the mini-card organic substrate and a system board to limit or prevent solder creep of solder connections between the mini-card organic substrate and the system board.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title MULTI-CHIP MODULE SYSTEM WITH REMOVABLE SOCKETED MODULES
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