BACKMETAL REPLACEMENT FOR USE IN THE PACKAGING OF INTEGRATED CIRCUITS

One aspect of the invention pertains to an arrangement for forming exposed die packages. The arrangement includes a semiconductor wafer having multiple integrated circuit dice whose back surfaces cooperate to form the back surface of the wafer. A thermally conductive adhesive layer is deposited on t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TU NGHIA T, WONG WILL K, BAYAN JAMIE A
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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