OPTICAL MODULE
Provided is an optical module in which wiring density may be reduced to ensure isolation between lines to reduce crosstalk. A flexible printed circuit includes: dielectric layers; a first pattern facing portion including a first ground conductor pattern and a first wiring pattern electrically connec...
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| creator | ARUGA HIROSHI OHASHI HIDEYUKI |
| description | Provided is an optical module in which wiring density may be reduced to ensure isolation between lines to reduce crosstalk. A flexible printed circuit includes: dielectric layers; a first pattern facing portion including a first ground conductor pattern and a first wiring pattern electrically connected to an electric terminal, which are facing each other through the dielectric layer; and a second pattern facing portion including a second ground conductor pattern and a second wiring pattern electrically connected to the electric terminal, which are facing each other through the dielectric layer, the second pattern facing portion facing the first pattern facing portion, in which when the dielectric layer is bent along a portion between the first pattern facing portion and the second pattern facing portion, at least one of the first ground conductor pattern and the second ground conductor pattern is located between the first wiring pattern and the second wiring pattern. |
| format | Patent |
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A flexible printed circuit includes: dielectric layers; a first pattern facing portion including a first ground conductor pattern and a first wiring pattern electrically connected to an electric terminal, which are facing each other through the dielectric layer; and a second pattern facing portion including a second ground conductor pattern and a second wiring pattern electrically connected to the electric terminal, which are facing each other through the dielectric layer, the second pattern facing portion facing the first pattern facing portion, in which when the dielectric layer is bent along a portion between the first pattern facing portion and the second pattern facing portion, at least one of the first ground conductor pattern and the second ground conductor pattern is located between the first wiring pattern and the second wiring pattern.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120112&DB=EPODOC&CC=US&NR=2012008289A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120112&DB=EPODOC&CC=US&NR=2012008289A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ARUGA HIROSHI</creatorcontrib><creatorcontrib>OHASHI HIDEYUKI</creatorcontrib><title>OPTICAL MODULE</title><description>Provided is an optical module in which wiring density may be reduced to ensure isolation between lines to reduce crosstalk. A flexible printed circuit includes: dielectric layers; a first pattern facing portion including a first ground conductor pattern and a first wiring pattern electrically connected to an electric terminal, which are facing each other through the dielectric layer; and a second pattern facing portion including a second ground conductor pattern and a second wiring pattern electrically connected to the electric terminal, which are facing each other through the dielectric layer, the second pattern facing portion facing the first pattern facing portion, in which when the dielectric layer is bent along a portion between the first pattern facing portion and the second pattern facing portion, at least one of the first ground conductor pattern and the second ground conductor pattern is located between the first wiring pattern and the second wiring pattern.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZODzDwjxdHb0UfD1dwn1ceVhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhkYGBhZGFpaOhsbEqQIAOrEd2w</recordid><startdate>20120112</startdate><enddate>20120112</enddate><creator>ARUGA HIROSHI</creator><creator>OHASHI HIDEYUKI</creator><scope>EVB</scope></search><sort><creationdate>20120112</creationdate><title>OPTICAL MODULE</title><author>ARUGA HIROSHI ; OHASHI HIDEYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2012008289A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2012</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>ARUGA HIROSHI</creatorcontrib><creatorcontrib>OHASHI HIDEYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ARUGA HIROSHI</au><au>OHASHI HIDEYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>OPTICAL MODULE</title><date>2012-01-12</date><risdate>2012</risdate><abstract>Provided is an optical module in which wiring density may be reduced to ensure isolation between lines to reduce crosstalk. A flexible printed circuit includes: dielectric layers; a first pattern facing portion including a first ground conductor pattern and a first wiring pattern electrically connected to an electric terminal, which are facing each other through the dielectric layer; and a second pattern facing portion including a second ground conductor pattern and a second wiring pattern electrically connected to the electric terminal, which are facing each other through the dielectric layer, the second pattern facing portion facing the first pattern facing portion, in which when the dielectric layer is bent along a portion between the first pattern facing portion and the second pattern facing portion, at least one of the first ground conductor pattern and the second ground conductor pattern is located between the first wiring pattern and the second wiring pattern.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PRINTED CIRCUITS |
| title | OPTICAL MODULE |
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