IMPLEMENTING SELECTIVE REWORK FOR CHIP STACKS AND SILICON CARRIER ASSEMBLIES

IMPLEMENTING SELECTIVE REWORK FOR CHIP STACKS AND SILICON CARRIER ASSEMBLIES

A method, apparatus, and structure are provided for implementing selective rework for chip stacks. A backside metal layer to create resistive heating is added to a chip backside in a chip stack. A rework tool applies a predefined current to the backside metal layer to reflow solder connections and e...

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Hauptverfasser: MAKI ANDREW BENSON, BARTLEY GERALD KEITH, BECKER DARRYL JOHN, GERMANN PHILIP RAYMOND
Format: Patent
Sprache:eng
Schlagworte:
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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creator MAKI ANDREW BENSON
BARTLEY GERALD KEITH
BECKER DARRYL JOHN
GERMANN PHILIP RAYMOND
description A method, apparatus, and structure are provided for implementing selective rework for chip stacks. A backside metal layer to create resistive heating is added to a chip backside in a chip stack. A rework tool applies a predefined current to the backside metal layer to reflow solder connections and enables separating selected chips in the chip stack.
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subjects CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title IMPLEMENTING SELECTIVE REWORK FOR CHIP STACKS AND SILICON CARRIER ASSEMBLIES
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