METHOD FOR CUTTING A PATCH TO BE APPLIED ONTO A CURVED SUBSTRATE

A method cuts a patch to be applied onto a curved substrate and includes the preliminary calculation of curvilinear lengths on the substrate between a reference point and a peripheral edge of said substrate. The calculated lengths are applied to a planar film for making the patch, and then the patch...

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Bibliographische Detailangaben
Hauptverfasser:	LAVILLONNIERE NICOLAS, LADOUS AGNES, ALLIONE PASCAL, BEGON CEDRIC
Format:	Patent
Sprache:	eng
Schlagworte:	CONTACT LENSES CUTTING DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GRINDING HAND CUTTING TOOLS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS POLISHING SEVERING SPECTACLES SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURESAS SPECTACLES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING
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