LIGHT EMITTING DEVICE
According to one embodiment, a light emitting device includes a first lead, a light emitting element, a second lead and a molded body. The first lead includes a die pad portion having a major surface and a recess provided in the major surface, and a bent portion bent toward above the major surface....
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creator | NAGAHATA YASUNORI MURANAKA TETSUYA |
description | According to one embodiment, a light emitting device includes a first lead, a light emitting element, a second lead and a molded body. The first lead includes a die pad portion having a major surface and a recess provided in the major surface, and a bent portion bent toward above the major surface. The light emitting element is bonded to a bottom surface of the recess. The second lead with one end portion is opposed to one end portion of the first lead. The molded body covers the light emitting element, the bent portion, the die pad portion, and the one end portion of the second lead, and is made of a resin. A position of barycenter of the molded body is set between a lower surface of the die pad portion and a plane including an upper end of the bent portion. |
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The first lead includes a die pad portion having a major surface and a recess provided in the major surface, and a bent portion bent toward above the major surface. The light emitting element is bonded to a bottom surface of the recess. The second lead with one end portion is opposed to one end portion of the first lead. The molded body covers the light emitting element, the bent portion, the die pad portion, and the one end portion of the second lead, and is made of a resin. A position of barycenter of the molded body is set between a lower surface of the die pad portion and a plane including an upper end of the bent portion.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111222&DB=EPODOC&CC=US&NR=2011309736A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111222&DB=EPODOC&CC=US&NR=2011309736A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAGAHATA YASUNORI</creatorcontrib><creatorcontrib>MURANAKA TETSUYA</creatorcontrib><title>LIGHT EMITTING DEVICE</title><description>According to one embodiment, a light emitting device includes a first lead, a light emitting element, a second lead and a molded body. The first lead includes a die pad portion having a major surface and a recess provided in the major surface, and a bent portion bent toward above the major surface. The light emitting element is bonded to a bottom surface of the recess. The second lead with one end portion is opposed to one end portion of the first lead. The molded body covers the light emitting element, the bent portion, the die pad portion, and the one end portion of the second lead, and is made of a resin. A position of barycenter of the molded body is set between a lower surface of the die pad portion and a plane including an upper end of the bent portion.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBD18XT3CFFw9fUMCfH0c1dwcQ3zdHblYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBoaGxgaW5sZmjobGxKkCAAoFH7k</recordid><startdate>20111222</startdate><enddate>20111222</enddate><creator>NAGAHATA YASUNORI</creator><creator>MURANAKA TETSUYA</creator><scope>EVB</scope></search><sort><creationdate>20111222</creationdate><title>LIGHT EMITTING DEVICE</title><author>NAGAHATA YASUNORI ; MURANAKA TETSUYA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2011309736A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>NAGAHATA YASUNORI</creatorcontrib><creatorcontrib>MURANAKA TETSUYA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAGAHATA YASUNORI</au><au>MURANAKA TETSUYA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LIGHT EMITTING DEVICE</title><date>2011-12-22</date><risdate>2011</risdate><abstract>According to one embodiment, a light emitting device includes a first lead, a light emitting element, a second lead and a molded body. The first lead includes a die pad portion having a major surface and a recess provided in the major surface, and a bent portion bent toward above the major surface. The light emitting element is bonded to a bottom surface of the recess. The second lead with one end portion is opposed to one end portion of the first lead. The molded body covers the light emitting element, the bent portion, the die pad portion, and the one end portion of the second lead, and is made of a resin. A position of barycenter of the molded body is set between a lower surface of the die pad portion and a plane including an upper end of the bent portion.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | LIGHT EMITTING DEVICE |
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