Method for cleaning substrates utilizing surface passivation and/or oxide layer growth to protect from pitting

A process/method for cleaning wafers that eliminates and/or reduces pitting caused by standard clean 1 by performing a pre-etch and then passivating the wafer surface prior to the application of the standard clean 1. The process/method may be especially useful for advanced front end of line post-CPM...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NOVAK RICHARD, NOLAN THOMAS, KASHKOUSH ISMAIL, NEMETH DENNIS
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!