TOUCH SENSING CIRCUIT AND METHOD FOR MAKING THE SAME

The present invention discloses a touch sensing circuit for capacitive touch panel formed on a substrate comprises a transparent conductive layer having a thickness of 100 -500 ; a conductive layer having a thickness of 1000 -5000 ; and an insulating layer having a thickness of 1 μm-5 μm disposed be...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HUANG PINGPING, CAI ZHIXIONG, HO KWAN-SIN, ZHANG HAO, YAN JIANBIN, XIAO TIEFEI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator HUANG PINGPING
CAI ZHIXIONG
HO KWAN-SIN
ZHANG HAO
YAN JIANBIN
XIAO TIEFEI
description The present invention discloses a touch sensing circuit for capacitive touch panel formed on a substrate comprises a transparent conductive layer having a thickness of 100 -500 ; a conductive layer having a thickness of 1000 -5000 ; and an insulating layer having a thickness of 1 μm-5 μm disposed between the transparent conductive layer and the conductive layer.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2011304582A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2011304582A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2011304582A13</originalsourceid><addsrcrecordid>eNrjZDAJ8Q919lAIdvUL9vRzV3D2DHIO9QxRcPRzUfB1DfHwd1Fw8w9S8HX0BsmGeLgqBDv6uvIwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvjQYCMDQ0NjAxNTCyNHQ2PiVAEAPw8n6Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>TOUCH SENSING CIRCUIT AND METHOD FOR MAKING THE SAME</title><source>esp@cenet</source><creator>HUANG PINGPING ; CAI ZHIXIONG ; HO KWAN-SIN ; ZHANG HAO ; YAN JIANBIN ; XIAO TIEFEI</creator><creatorcontrib>HUANG PINGPING ; CAI ZHIXIONG ; HO KWAN-SIN ; ZHANG HAO ; YAN JIANBIN ; XIAO TIEFEI</creatorcontrib><description>The present invention discloses a touch sensing circuit for capacitive touch panel formed on a substrate comprises a transparent conductive layer having a thickness of 100 -500 ; a conductive layer having a thickness of 1000 -5000 ; and an insulating layer having a thickness of 1 μm-5 μm disposed between the transparent conductive layer and the conductive layer.</description><language>eng</language><subject>CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20111215&amp;DB=EPODOC&amp;CC=US&amp;NR=2011304582A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20111215&amp;DB=EPODOC&amp;CC=US&amp;NR=2011304582A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUANG PINGPING</creatorcontrib><creatorcontrib>CAI ZHIXIONG</creatorcontrib><creatorcontrib>HO KWAN-SIN</creatorcontrib><creatorcontrib>ZHANG HAO</creatorcontrib><creatorcontrib>YAN JIANBIN</creatorcontrib><creatorcontrib>XIAO TIEFEI</creatorcontrib><title>TOUCH SENSING CIRCUIT AND METHOD FOR MAKING THE SAME</title><description>The present invention discloses a touch sensing circuit for capacitive touch panel formed on a substrate comprises a transparent conductive layer having a thickness of 100 -500 ; a conductive layer having a thickness of 1000 -5000 ; and an insulating layer having a thickness of 1 μm-5 μm disposed between the transparent conductive layer and the conductive layer.</description><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAJ8Q919lAIdvUL9vRzV3D2DHIO9QxRcPRzUfB1DfHwd1Fw8w9S8HX0BsmGeLgqBDv6uvIwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvjQYCMDQ0NjAxNTCyNHQ2PiVAEAPw8n6Q</recordid><startdate>20111215</startdate><enddate>20111215</enddate><creator>HUANG PINGPING</creator><creator>CAI ZHIXIONG</creator><creator>HO KWAN-SIN</creator><creator>ZHANG HAO</creator><creator>YAN JIANBIN</creator><creator>XIAO TIEFEI</creator><scope>EVB</scope></search><sort><creationdate>20111215</creationdate><title>TOUCH SENSING CIRCUIT AND METHOD FOR MAKING THE SAME</title><author>HUANG PINGPING ; CAI ZHIXIONG ; HO KWAN-SIN ; ZHANG HAO ; YAN JIANBIN ; XIAO TIEFEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2011304582A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>HUANG PINGPING</creatorcontrib><creatorcontrib>CAI ZHIXIONG</creatorcontrib><creatorcontrib>HO KWAN-SIN</creatorcontrib><creatorcontrib>ZHANG HAO</creatorcontrib><creatorcontrib>YAN JIANBIN</creatorcontrib><creatorcontrib>XIAO TIEFEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUANG PINGPING</au><au>CAI ZHIXIONG</au><au>HO KWAN-SIN</au><au>ZHANG HAO</au><au>YAN JIANBIN</au><au>XIAO TIEFEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TOUCH SENSING CIRCUIT AND METHOD FOR MAKING THE SAME</title><date>2011-12-15</date><risdate>2011</risdate><abstract>The present invention discloses a touch sensing circuit for capacitive touch panel formed on a substrate comprises a transparent conductive layer having a thickness of 100 -500 ; a conductive layer having a thickness of 1000 -5000 ; and an insulating layer having a thickness of 1 μm-5 μm disposed between the transparent conductive layer and the conductive layer.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2011304582A1
source esp@cenet
subjects CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
title TOUCH SENSING CIRCUIT AND METHOD FOR MAKING THE SAME
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-19T02%3A44%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HUANG%20PINGPING&rft.date=2011-12-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2011304582A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true