TOUCH SENSING CIRCUIT AND METHOD FOR MAKING THE SAME
The present invention discloses a touch sensing circuit for capacitive touch panel formed on a substrate comprises a transparent conductive layer having a thickness of 100 -500 ; a conductive layer having a thickness of 1000 -5000 ; and an insulating layer having a thickness of 1 μm-5 μm disposed be...
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creator | HUANG PINGPING CAI ZHIXIONG HO KWAN-SIN ZHANG HAO YAN JIANBIN XIAO TIEFEI |
description | The present invention discloses a touch sensing circuit for capacitive touch panel formed on a substrate comprises a transparent conductive layer having a thickness of 100 -500 ; a conductive layer having a thickness of 1000 -5000 ; and an insulating layer having a thickness of 1 μm-5 μm disposed between the transparent conductive layer and the conductive layer. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2011304582A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2011304582A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2011304582A13</originalsourceid><addsrcrecordid>eNrjZDAJ8Q919lAIdvUL9vRzV3D2DHIO9QxRcPRzUfB1DfHwd1Fw8w9S8HX0BsmGeLgqBDv6uvIwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvjQYCMDQ0NjAxNTCyNHQ2PiVAEAPw8n6Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>TOUCH SENSING CIRCUIT AND METHOD FOR MAKING THE SAME</title><source>esp@cenet</source><creator>HUANG PINGPING ; CAI ZHIXIONG ; HO KWAN-SIN ; ZHANG HAO ; YAN JIANBIN ; XIAO TIEFEI</creator><creatorcontrib>HUANG PINGPING ; CAI ZHIXIONG ; HO KWAN-SIN ; ZHANG HAO ; YAN JIANBIN ; XIAO TIEFEI</creatorcontrib><description>The present invention discloses a touch sensing circuit for capacitive touch panel formed on a substrate comprises a transparent conductive layer having a thickness of 100 -500 ; a conductive layer having a thickness of 1000 -5000 ; and an insulating layer having a thickness of 1 μm-5 μm disposed between the transparent conductive layer and the conductive layer.</description><language>eng</language><subject>CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PRINTED CIRCUITS</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111215&DB=EPODOC&CC=US&NR=2011304582A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111215&DB=EPODOC&CC=US&NR=2011304582A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUANG PINGPING</creatorcontrib><creatorcontrib>CAI ZHIXIONG</creatorcontrib><creatorcontrib>HO KWAN-SIN</creatorcontrib><creatorcontrib>ZHANG HAO</creatorcontrib><creatorcontrib>YAN JIANBIN</creatorcontrib><creatorcontrib>XIAO TIEFEI</creatorcontrib><title>TOUCH SENSING CIRCUIT AND METHOD FOR MAKING THE SAME</title><description>The present invention discloses a touch sensing circuit for capacitive touch panel formed on a substrate comprises a transparent conductive layer having a thickness of 100 -500 ; a conductive layer having a thickness of 1000 -5000 ; and an insulating layer having a thickness of 1 μm-5 μm disposed between the transparent conductive layer and the conductive layer.</description><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAJ8Q919lAIdvUL9vRzV3D2DHIO9QxRcPRzUfB1DfHwd1Fw8w9S8HX0BsmGeLgqBDv6uvIwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvjQYCMDQ0NjAxNTCyNHQ2PiVAEAPw8n6Q</recordid><startdate>20111215</startdate><enddate>20111215</enddate><creator>HUANG PINGPING</creator><creator>CAI ZHIXIONG</creator><creator>HO KWAN-SIN</creator><creator>ZHANG HAO</creator><creator>YAN JIANBIN</creator><creator>XIAO TIEFEI</creator><scope>EVB</scope></search><sort><creationdate>20111215</creationdate><title>TOUCH SENSING CIRCUIT AND METHOD FOR MAKING THE SAME</title><author>HUANG PINGPING ; CAI ZHIXIONG ; HO KWAN-SIN ; ZHANG HAO ; YAN JIANBIN ; XIAO TIEFEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2011304582A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>HUANG PINGPING</creatorcontrib><creatorcontrib>CAI ZHIXIONG</creatorcontrib><creatorcontrib>HO KWAN-SIN</creatorcontrib><creatorcontrib>ZHANG HAO</creatorcontrib><creatorcontrib>YAN JIANBIN</creatorcontrib><creatorcontrib>XIAO TIEFEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUANG PINGPING</au><au>CAI ZHIXIONG</au><au>HO KWAN-SIN</au><au>ZHANG HAO</au><au>YAN JIANBIN</au><au>XIAO TIEFEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TOUCH SENSING CIRCUIT AND METHOD FOR MAKING THE SAME</title><date>2011-12-15</date><risdate>2011</risdate><abstract>The present invention discloses a touch sensing circuit for capacitive touch panel formed on a substrate comprises a transparent conductive layer having a thickness of 100 -500 ; a conductive layer having a thickness of 1000 -5000 ; and an insulating layer having a thickness of 1 μm-5 μm disposed between the transparent conductive layer and the conductive layer.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS |
title | TOUCH SENSING CIRCUIT AND METHOD FOR MAKING THE SAME |
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