PACKAGE FOR A LIGHT EMITTING DIODE AND METHOD FOR FABRICATING THE SAME

A method for fabricating a LED includes: providing a metal substrate; etching the metal substrate to form a first terminal, a second terminal, and a gap between the first terminal and the second terminal, wherein the first terminal has at least one first etching concave and the second terminal has a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG BILY, CHUANG JONNIE, HUANG HUI-YEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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