Lens Module And Wafer Level Lens Module Manufacturing Apparatus
Example embodiments are directed to a lens module manufactured from a wafer and a wafer level lens module manufacturing apparatus. The wafer level lens module manufacturing apparatus to mold lenses on a wafer provided with lens holes includes a first master substrate and a second master substrate di...
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creator | UH JI HO |
description | Example embodiments are directed to a lens module manufactured from a wafer and a wafer level lens module manufacturing apparatus. The wafer level lens module manufacturing apparatus to mold lenses on a wafer provided with lens holes includes a first master substrate and a second master substrate disposed such that the wafer is between the first master substrate and the second master substrate. The wafer level lens module manufacturing apparatus also includes lens molding parts that enter the lens holes and are on at least one of the first master substrate and the second master substrate. The lens is molded to have a thickness less than that of the wafer using the first lens molding parts and second lens molding parts, and both surfaces of the lens are inside the lens hole. Therefore, even if wafers provided with lenses are stacked on each other, the lens does not contact the surfaces of the neighboring wafers or the lenses molded on the neighboring wafers. |
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The wafer level lens module manufacturing apparatus to mold lenses on a wafer provided with lens holes includes a first master substrate and a second master substrate disposed such that the wafer is between the first master substrate and the second master substrate. The wafer level lens module manufacturing apparatus also includes lens molding parts that enter the lens holes and are on at least one of the first master substrate and the second master substrate. The lens is molded to have a thickness less than that of the wafer using the first lens molding parts and second lens molding parts, and both surfaces of the lens are inside the lens hole. Therefore, even if wafers provided with lenses are stacked on each other, the lens does not contact the surfaces of the neighboring wafers or the lenses molded on the neighboring wafers.</description><language>eng</language><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PERFORMING OPERATIONS ; PHYSICS ; PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111124&DB=EPODOC&CC=US&NR=2011286118A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111124&DB=EPODOC&CC=US&NR=2011286118A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>UH JI HO</creatorcontrib><title>Lens Module And Wafer Level Lens Module Manufacturing Apparatus</title><description>Example embodiments are directed to a lens module manufactured from a wafer and a wafer level lens module manufacturing apparatus. The wafer level lens module manufacturing apparatus to mold lenses on a wafer provided with lens holes includes a first master substrate and a second master substrate disposed such that the wafer is between the first master substrate and the second master substrate. The wafer level lens module manufacturing apparatus also includes lens molding parts that enter the lens holes and are on at least one of the first master substrate and the second master substrate. The lens is molded to have a thickness less than that of the wafer using the first lens molding parts and second lens molding parts, and both surfaces of the lens are inside the lens hole. Therefore, even if wafers provided with lenses are stacked on each other, the lens does not contact the surfaces of the neighboring wafers or the lenses molded on the neighboring wafers.</description><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD3Sc0rVvDNTynNSVVwzEtRCE9MSy1S8EktS81RQJbzTcwrTUtMLiktysxLV3AsKEgsSiwpLeZhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGhoZGFmaGhhaOhsbEqQIA2toxCw</recordid><startdate>20111124</startdate><enddate>20111124</enddate><creator>UH JI HO</creator><scope>EVB</scope></search><sort><creationdate>20111124</creationdate><title>Lens Module And Wafer Level Lens Module Manufacturing Apparatus</title><author>UH JI HO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2011286118A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>UH JI HO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>UH JI HO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Lens Module And Wafer Level Lens Module Manufacturing Apparatus</title><date>2011-11-24</date><risdate>2011</risdate><abstract>Example embodiments are directed to a lens module manufactured from a wafer and a wafer level lens module manufacturing apparatus. The wafer level lens module manufacturing apparatus to mold lenses on a wafer provided with lens holes includes a first master substrate and a second master substrate disposed such that the wafer is between the first master substrate and the second master substrate. The wafer level lens module manufacturing apparatus also includes lens molding parts that enter the lens holes and are on at least one of the first master substrate and the second master substrate. The lens is molded to have a thickness less than that of the wafer using the first lens molding parts and second lens molding parts, and both surfaces of the lens are inside the lens hole. Therefore, even if wafers provided with lenses are stacked on each other, the lens does not contact the surfaces of the neighboring wafers or the lenses molded on the neighboring wafers.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
title | Lens Module And Wafer Level Lens Module Manufacturing Apparatus |
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