ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURE

A method of manufacturing an electronic device package. Coating a first side of a metallic layer with a first insulating layer and coating a second opposite side of the metallic layer with a second insulating layer. Patterning the first insulating layer to expose bonding locations on the first side...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LOW QWAI, VARIOT PATRICK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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