Flexible Printed Board
Flexible printed board, in particular for the spatial connection of electronic components, comprising a carrier foil (1), several bonding surfaces (10) arranged on the carrier foil (1), several soldering surfaces (2) arranged on the carrier foil (1), which soldering surfaces (2) are connected to the...
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| creator | BAUMANN KARL-HEINZ LIEBL TILO BAUER GERHARD VOEGERL ANDREAS GEBHARDT MARION WIECZOREK MATTHIAS HENNIGER JUERGEN WENK ALEXANDER |
| description | Flexible printed board, in particular for the spatial connection of electronic components, comprising a carrier foil (1), several bonding surfaces (10) arranged on the carrier foil (1), several soldering surfaces (2) arranged on the carrier foil (1), which soldering surfaces (2) are connected to the bonding surfaces (10) via electrical strip conductors, and a stiffening plate (3) that is inseparably connected to the carrier foil (1), wherein the soldering surfaces (2) and the stiffening plate (3) are arranged on a solder side (4) of the carrier foil (1) and the bonding surfaces (10) are arranged on a bonding side (12) that is arranged opposite the solder side (4). |
| format | Patent |
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ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110929&DB=EPODOC&CC=US&NR=2011232946A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110929&DB=EPODOC&CC=US&NR=2011232946A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BAUMANN KARL-HEINZ</creatorcontrib><creatorcontrib>LIEBL TILO</creatorcontrib><creatorcontrib>BAUER GERHARD</creatorcontrib><creatorcontrib>VOEGERL ANDREAS</creatorcontrib><creatorcontrib>GEBHARDT MARION</creatorcontrib><creatorcontrib>WIECZOREK MATTHIAS</creatorcontrib><creatorcontrib>HENNIGER JUERGEN</creatorcontrib><creatorcontrib>WENK ALEXANDER</creatorcontrib><title>Flexible Printed Board</title><description>Flexible printed board, in particular for the spatial connection of electronic components, comprising a carrier foil (1), several bonding surfaces (10) arranged on the carrier foil (1), several soldering surfaces (2) arranged on the carrier foil (1), which soldering surfaces (2) are connected to the bonding surfaces (10) via electrical strip conductors, and a stiffening plate (3) that is inseparably connected to the carrier foil (1), wherein the soldering surfaces (2) and the stiffening plate (3) are arranged on a solder side (4) of the carrier foil (1) and the bonding surfaces (10) are arranged on a bonding side (12) that is arranged opposite the solder side (4).</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBzy0mtyEzKSVUIKMrMK0lNUXDKTyxK4WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgaGhkbGRpYmZo6GxsSpAgADGSIW</recordid><startdate>20110929</startdate><enddate>20110929</enddate><creator>BAUMANN KARL-HEINZ</creator><creator>LIEBL TILO</creator><creator>BAUER GERHARD</creator><creator>VOEGERL ANDREAS</creator><creator>GEBHARDT MARION</creator><creator>WIECZOREK MATTHIAS</creator><creator>HENNIGER JUERGEN</creator><creator>WENK ALEXANDER</creator><scope>EVB</scope></search><sort><creationdate>20110929</creationdate><title>Flexible Printed Board</title><author>BAUMANN KARL-HEINZ ; 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| language | eng |
| recordid | cdi_epo_espacenet_US2011232946A1 |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS |
| title | Flexible Printed Board |
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