ADSORBING MOLDED BODY, ADSORPTION RECOVERY TREATMENT APPARATUS, AND ADSORBATE DESORBING METHOD (amended

An adsorbing molded body is configured to be subjected to ohmic heating or electromagnetic wave heating. The adsorbing molded body includes an electrically conductive powder adsorbent, an insulating powder adsorbent, and an inorganic binder that binds the powder adsorbents together. An adsorption re...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YAMASHITA KIMINARI, KAMETANI KEIICHIROU, UTAKA YUKIHIRO, SAITOU AIKO, NAGANO YOSHINOBU
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator YAMASHITA KIMINARI
KAMETANI KEIICHIROU
UTAKA YUKIHIRO
SAITOU AIKO
NAGANO YOSHINOBU
description An adsorbing molded body is configured to be subjected to ohmic heating or electromagnetic wave heating. The adsorbing molded body includes an electrically conductive powder adsorbent, an insulating powder adsorbent, and an inorganic binder that binds the powder adsorbents together. An adsorption recovery treatment apparatus includes the adsorbing molded body and a heating unit to heat the adsorbing molded body, preferably ohmically or using electromagnetic waves. An adsorbate desorbing method includes desorbing an adsorbate, which the adsorbing molded body has adsorbed, from the adsorbing molded body by heating the adsorbing molded body, preferably ohmically or using electromagnetic waves.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2011230331A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2011230331A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2011230331A13</originalsourceid><addsrcrecordid>eNqNzMEKgkAQxnEvHaJ6h4EuHQpc9wlGZ0ohd2UdBU8iuXUpE-z9KSo6d_rgz49vHlyQSuvizBwgt0digthSs4V3LiSzBhwntmbXgDhGydkIYFGgQ6nKFzT0wTEKA_HvjSW1BJvu5ofe98tgdu6uk199dxGs9yxJuvPjvfXT2J384B9tVUahUpEOtVao9H_qCQ0_Nuk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ADSORBING MOLDED BODY, ADSORPTION RECOVERY TREATMENT APPARATUS, AND ADSORBATE DESORBING METHOD (amended</title><source>esp@cenet</source><creator>YAMASHITA KIMINARI ; KAMETANI KEIICHIROU ; UTAKA YUKIHIRO ; SAITOU AIKO ; NAGANO YOSHINOBU</creator><creatorcontrib>YAMASHITA KIMINARI ; KAMETANI KEIICHIROU ; UTAKA YUKIHIRO ; SAITOU AIKO ; NAGANO YOSHINOBU</creatorcontrib><description>An adsorbing molded body is configured to be subjected to ohmic heating or electromagnetic wave heating. The adsorbing molded body includes an electrically conductive powder adsorbent, an insulating powder adsorbent, and an inorganic binder that binds the powder adsorbents together. An adsorption recovery treatment apparatus includes the adsorbing molded body and a heating unit to heat the adsorbing molded body, preferably ohmically or using electromagnetic waves. An adsorbate desorbing method includes desorbing an adsorbate, which the adsorbing molded body has adsorbed, from the adsorbing molded body by heating the adsorbing molded body, preferably ohmically or using electromagnetic waves.</description><language>eng</language><subject>CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY ; PERFORMING OPERATIONS ; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL ; SEPARATION ; THEIR RELEVANT APPARATUS ; TRANSPORTING</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20110922&amp;DB=EPODOC&amp;CC=US&amp;NR=2011230331A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20110922&amp;DB=EPODOC&amp;CC=US&amp;NR=2011230331A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMASHITA KIMINARI</creatorcontrib><creatorcontrib>KAMETANI KEIICHIROU</creatorcontrib><creatorcontrib>UTAKA YUKIHIRO</creatorcontrib><creatorcontrib>SAITOU AIKO</creatorcontrib><creatorcontrib>NAGANO YOSHINOBU</creatorcontrib><title>ADSORBING MOLDED BODY, ADSORPTION RECOVERY TREATMENT APPARATUS, AND ADSORBATE DESORBING METHOD (amended</title><description>An adsorbing molded body is configured to be subjected to ohmic heating or electromagnetic wave heating. The adsorbing molded body includes an electrically conductive powder adsorbent, an insulating powder adsorbent, and an inorganic binder that binds the powder adsorbents together. An adsorption recovery treatment apparatus includes the adsorbing molded body and a heating unit to heat the adsorbing molded body, preferably ohmically or using electromagnetic waves. An adsorbate desorbing method includes desorbing an adsorbate, which the adsorbing molded body has adsorbed, from the adsorbing molded body by heating the adsorbing molded body, preferably ohmically or using electromagnetic waves.</description><subject>CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</subject><subject>SEPARATION</subject><subject>THEIR RELEVANT APPARATUS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzMEKgkAQxnEvHaJ6h4EuHQpc9wlGZ0ohd2UdBU8iuXUpE-z9KSo6d_rgz49vHlyQSuvizBwgt0digthSs4V3LiSzBhwntmbXgDhGydkIYFGgQ6nKFzT0wTEKA_HvjSW1BJvu5ofe98tgdu6uk199dxGs9yxJuvPjvfXT2J384B9tVUahUpEOtVao9H_qCQ0_Nuk</recordid><startdate>20110922</startdate><enddate>20110922</enddate><creator>YAMASHITA KIMINARI</creator><creator>KAMETANI KEIICHIROU</creator><creator>UTAKA YUKIHIRO</creator><creator>SAITOU AIKO</creator><creator>NAGANO YOSHINOBU</creator><scope>EVB</scope></search><sort><creationdate>20110922</creationdate><title>ADSORBING MOLDED BODY, ADSORPTION RECOVERY TREATMENT APPARATUS, AND ADSORBATE DESORBING METHOD (amended</title><author>YAMASHITA KIMINARI ; KAMETANI KEIICHIROU ; UTAKA YUKIHIRO ; SAITOU AIKO ; NAGANO YOSHINOBU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2011230331A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</topic><topic>SEPARATION</topic><topic>THEIR RELEVANT APPARATUS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>YAMASHITA KIMINARI</creatorcontrib><creatorcontrib>KAMETANI KEIICHIROU</creatorcontrib><creatorcontrib>UTAKA YUKIHIRO</creatorcontrib><creatorcontrib>SAITOU AIKO</creatorcontrib><creatorcontrib>NAGANO YOSHINOBU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAMASHITA KIMINARI</au><au>KAMETANI KEIICHIROU</au><au>UTAKA YUKIHIRO</au><au>SAITOU AIKO</au><au>NAGANO YOSHINOBU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ADSORBING MOLDED BODY, ADSORPTION RECOVERY TREATMENT APPARATUS, AND ADSORBATE DESORBING METHOD (amended</title><date>2011-09-22</date><risdate>2011</risdate><abstract>An adsorbing molded body is configured to be subjected to ohmic heating or electromagnetic wave heating. The adsorbing molded body includes an electrically conductive powder adsorbent, an insulating powder adsorbent, and an inorganic binder that binds the powder adsorbents together. An adsorption recovery treatment apparatus includes the adsorbing molded body and a heating unit to heat the adsorbing molded body, preferably ohmically or using electromagnetic waves. An adsorbate desorbing method includes desorbing an adsorbate, which the adsorbing molded body has adsorbed, from the adsorbing molded body by heating the adsorbing molded body, preferably ohmically or using electromagnetic waves.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2011230331A1
source esp@cenet
subjects CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
SEPARATION
THEIR RELEVANT APPARATUS
TRANSPORTING
title ADSORBING MOLDED BODY, ADSORPTION RECOVERY TREATMENT APPARATUS, AND ADSORBATE DESORBING METHOD (amended
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-05T04%3A22%3A35IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YAMASHITA%20KIMINARI&rft.date=2011-09-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2011230331A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true