ELECTRONIC COMPONENT MOUNTING SYSTEM

It is an object to provide an electronic component mounting system capable of concurrently, efficiently subjecting a plurality of substrates to component mounting operation and accomplishing both high productivity and a capability of addressing production of multiple products. An electronic componen...

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1. Verfasser: NAGAO KAZUHIDE
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creator NAGAO KAZUHIDE
description It is an object to provide an electronic component mounting system capable of concurrently, efficiently subjecting a plurality of substrates to component mounting operation and accomplishing both high productivity and a capability of addressing production of multiple products. An electronic component mounting system is configured by arranging, on an upstream side of a component loading unit having a plurality of substrate conveyance mechanisms, a screen printer M2 having a plurality of individual printing mechanisms and a coating and inspection machine M4 that applies a coat of a resin for use in boding an electronic component and that inspects a coated state. The coating and inspection machine M4 is equipped with a coating head 15 that performs operation for coating substrates conveyed by substrate conveyance mechanisms 12A and 12B from the screen printer M2 with the resin and an inspection head 16 that performs pre-coating inspection and post-coating inspection.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
title ELECTRONIC COMPONENT MOUNTING SYSTEM
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