OPTIMIZED LID ATTACH PROCESS FOR THERMAL MANAGEMENT AND MULTI-SURFACE COMPLIANT HEAT REMOVAL

A multi-surface compliant heat removal process includes: identifying one or more components to share a heat rejecting device; applying non-adhesive film to the one or more components; identifying a primary component of the one or more components; and applying phase change material on each of the one...

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Hauptverfasser: GEKTIN VADIM, MALLADI DEVIPRASAD
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creator GEKTIN VADIM
MALLADI DEVIPRASAD
description A multi-surface compliant heat removal process includes: identifying one or more components to share a heat rejecting device; applying non-adhesive film to the one or more components; identifying a primary component of the one or more components; and applying phase change material on each of the one or more components other than the primary component. The phase change material is placed on top of the non-adhesive film. The process further includes placing the heat rejecting device on the corresponding one or more components; and removing the heat rejecting device from the corresponding one or more components. The phase change material and the non-adhesive film remain with the heat rejecting device. The process also includes reflowing the phase change material on the heat rejecting device; removing the non-adhesive film from the heat rejecting device; placing a heatsink-attach thermal interface material on the one or more components; and placing the heat rejecting device on the corresponding one or more components.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title OPTIMIZED LID ATTACH PROCESS FOR THERMAL MANAGEMENT AND MULTI-SURFACE COMPLIANT HEAT REMOVAL
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