Wafer-Level Semiconductor Device Packages with Three-Dimensional Fan-Out and Manufacturing Methods Thereof

In one embodiment, a method of forming a semiconductor device package includes: (1) providing a carrier and a semiconductor device including an active surface; (2) forming a first redistribution structure including a first electrical interconnect extending laterally within the first structure and a...

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Bibliographische Detailangaben

Hauptverfasser:	WANG CHIEN-HAO, LEE MINGIANG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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