OPTIMIZING PCB POWER AND GROUND CONNECTIONS FOR LEAD FREE SOLDER PROCESSES

Apparatuses and methods that provide for enhanced connections between PTHs of multi-layer PCBs and electronic component leads, pins or the like. The apparatuses and methods improve the likelihood that the PTHs are completely filled with solder thereby advantageously allowing the PCBs to exhibit high...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MARTINEZ-VARGAS, JR. JORGE EDUARDO, BRITTON JAMES DAVID
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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