METHOD OF FORMING AT LEAST ONE BONDING STRUCTURE

A method of forming at least one bonding structure may be provided. A ball may be formed on the front end of a wire outside a capillary. The capillary may be moved downwardly to form a preliminary compressed ball on a first pad using the ball. The capillary may be moved upwardly to form a neck porti...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SONG HO-GEON, RYU HWANG-BOK, PARK JAE-YONG, JUNG KY-HYUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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