PROCESSING FOR OVERCOMING EXTREME TOPOGRAPHY

A process for overcoming extreme topographies by first planarizing a cavity in a semiconductor substrate in order to create a planar surface for subsequent lithography processing. As a result of the planarizing process for extreme topographies, subsequent lithography processing is enabled including...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	COHEN GUY A, GOMA SHERIF A, TREWHELLA JEANNINE M, CORDES STEVEN A, ROSNER JOANNA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!