WET ETCHED INSULATOR AND ELECTRONIC CIRCUIT COMPONENT

The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KAWANO SHIGEKI, SAKIHAMA NOBUHIRO, SAKAYORI KATSUYA, AMASAKI HIROKO, YAMAZAKI TSUYOSHI, UCHIYAMA MICHIAKI, MOMOSE TERUTOSHI, TOGASHI TOMOKO, YAGI HIROSHI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator KAWANO SHIGEKI
SAKIHAMA NOBUHIRO
SAKAYORI KATSUYA
AMASAKI HIROKO
YAMAZAKI TSUYOSHI
UCHIYAMA MICHIAKI
MOMOSE TERUTOSHI
TOGASHI TOMOKO
YAGI HIROSHI
description The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2011108519A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2011108519A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2011108519A13</originalsourceid><addsrcrecordid>eNrjZDANdw1RcA1x9nB1UfD0Cw71cQzxD1Jw9HNRcPVxdQ4J8vfzdFZw9gxyDvUMUXD29w3w93P1C-FhYE1LzClO5YXS3AzKbiBDdFML8uNTiwsSk1PzUkviQ4ONDAwNDQ0sTA0tHQ2NiVMFAJKOKKc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>WET ETCHED INSULATOR AND ELECTRONIC CIRCUIT COMPONENT</title><source>esp@cenet</source><creator>KAWANO SHIGEKI ; SAKIHAMA NOBUHIRO ; SAKAYORI KATSUYA ; AMASAKI HIROKO ; YAMAZAKI TSUYOSHI ; UCHIYAMA MICHIAKI ; MOMOSE TERUTOSHI ; TOGASHI TOMOKO ; YAGI HIROSHI</creator><creatorcontrib>KAWANO SHIGEKI ; SAKIHAMA NOBUHIRO ; SAKAYORI KATSUYA ; AMASAKI HIROKO ; YAMAZAKI TSUYOSHI ; UCHIYAMA MICHIAKI ; MOMOSE TERUTOSHI ; TOGASHI TOMOKO ; YAGI HIROSHI</creatorcontrib><description>The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20110512&amp;DB=EPODOC&amp;CC=US&amp;NR=2011108519A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20110512&amp;DB=EPODOC&amp;CC=US&amp;NR=2011108519A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAWANO SHIGEKI</creatorcontrib><creatorcontrib>SAKIHAMA NOBUHIRO</creatorcontrib><creatorcontrib>SAKAYORI KATSUYA</creatorcontrib><creatorcontrib>AMASAKI HIROKO</creatorcontrib><creatorcontrib>YAMAZAKI TSUYOSHI</creatorcontrib><creatorcontrib>UCHIYAMA MICHIAKI</creatorcontrib><creatorcontrib>MOMOSE TERUTOSHI</creatorcontrib><creatorcontrib>TOGASHI TOMOKO</creatorcontrib><creatorcontrib>YAGI HIROSHI</creatorcontrib><title>WET ETCHED INSULATOR AND ELECTRONIC CIRCUIT COMPONENT</title><description>The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDANdw1RcA1x9nB1UfD0Cw71cQzxD1Jw9HNRcPVxdQ4J8vfzdFZw9gxyDvUMUXD29w3w93P1C-FhYE1LzClO5YXS3AzKbiBDdFML8uNTiwsSk1PzUkviQ4ONDAwNDQ0sTA0tHQ2NiVMFAJKOKKc</recordid><startdate>20110512</startdate><enddate>20110512</enddate><creator>KAWANO SHIGEKI</creator><creator>SAKIHAMA NOBUHIRO</creator><creator>SAKAYORI KATSUYA</creator><creator>AMASAKI HIROKO</creator><creator>YAMAZAKI TSUYOSHI</creator><creator>UCHIYAMA MICHIAKI</creator><creator>MOMOSE TERUTOSHI</creator><creator>TOGASHI TOMOKO</creator><creator>YAGI HIROSHI</creator><scope>EVB</scope></search><sort><creationdate>20110512</creationdate><title>WET ETCHED INSULATOR AND ELECTRONIC CIRCUIT COMPONENT</title><author>KAWANO SHIGEKI ; SAKIHAMA NOBUHIRO ; SAKAYORI KATSUYA ; AMASAKI HIROKO ; YAMAZAKI TSUYOSHI ; UCHIYAMA MICHIAKI ; MOMOSE TERUTOSHI ; TOGASHI TOMOKO ; YAGI HIROSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2011108519A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KAWANO SHIGEKI</creatorcontrib><creatorcontrib>SAKIHAMA NOBUHIRO</creatorcontrib><creatorcontrib>SAKAYORI KATSUYA</creatorcontrib><creatorcontrib>AMASAKI HIROKO</creatorcontrib><creatorcontrib>YAMAZAKI TSUYOSHI</creatorcontrib><creatorcontrib>UCHIYAMA MICHIAKI</creatorcontrib><creatorcontrib>MOMOSE TERUTOSHI</creatorcontrib><creatorcontrib>TOGASHI TOMOKO</creatorcontrib><creatorcontrib>YAGI HIROSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAWANO SHIGEKI</au><au>SAKIHAMA NOBUHIRO</au><au>SAKAYORI KATSUYA</au><au>AMASAKI HIROKO</au><au>YAMAZAKI TSUYOSHI</au><au>UCHIYAMA MICHIAKI</au><au>MOMOSE TERUTOSHI</au><au>TOGASHI TOMOKO</au><au>YAGI HIROSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WET ETCHED INSULATOR AND ELECTRONIC CIRCUIT COMPONENT</title><date>2011-05-12</date><risdate>2011</risdate><abstract>The present invention relates to an insulator as an insulating layer in a laminate which can inhibit dusting at the time of use, more particularly an electronic circuit component to which the insulator has been applied, particularly a wireless suspension. The insulator comprises a laminate of one or more insulation unit layers etchable by a wet process, the insulator having been subjected to plasma treatment after wet etching. The insulator exists mainly as an insulating layer in a laminate having a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer, and at least a part of the inorganic material layer has been removed to expose the insulating layer.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2011108519A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
title WET ETCHED INSULATOR AND ELECTRONIC CIRCUIT COMPONENT
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-26T13%3A14%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KAWANO%20SHIGEKI&rft.date=2011-05-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2011108519A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true